The “Nano-Level Polishing” of Chips: How CMP Smooths Multi-Layer Circuits?
In chip manufacturing, there is an “invisible hero”—without it, multi-layer metal circuits would resemble “uneven mountain roads,” making precise lithography impossible, and achieving 7nm or 5nm processes would be a fantasy. This hero isChemical Mechanical Polishing (CMP), which can control the surface undulations of silicon wafers within 50Å (0.005μm), achieving true “global flattening.” Today, we … Read more
