equipment development

Chemical Mechanical Polishing (CMP): The Only Process That Can Achieve a “Mirror Finish” on Silicon Wafers, Current Status and Challenges

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Behind the 7nm circuits of mobile phone chips and the 10nm flying height of computer hard disk heads lies a key technology – Chemical Mechanical Polishing (CMP). It is currently the only process capable of achieving “global planarization” of silicon wafers. Without it, the reduction in device size and multilayer interconnections would become a “castle … Read more

In-House Core Equipment! Pruessler’s Four Major Hot Forming Devices Enhance Quality and Efficiency in Automotive Parts Manufacturing

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In-House Core Equipment! Pruessler's Four Major Hot Forming Devices Enhance Quality and Efficiency in Automotive Parts Manufacturing

Driven by the dual demands of lightweight and safety in automobiles, hot forming technology has become a core aspect of enhancing the quality and efficiency of automotive manufacturing. Pruessler has been deeply involved in the processing of automotive hot forming components for many years, maintaining a leading position in the industry thanks to its strong … Read more

The ‘New Kailai’ Moment in Chinese Chip Equipment Manufacturing

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The 'New Kailai' Moment in Chinese Chip Equipment Manufacturing

March 26, 2025, Shanghai New International Expo Center Hall 3. In front of a booth, a crowd gathers, A group of spectators is crowded in front, trying to see the names of the equipment manufacturers on display. A new semiconductor equipment manufacturing company, New Kailai. 1. The mountains are all present, but the Himalayas are … Read more