With the rapid development of 3D-IC, system-level packaging, and high-density interconnect (HDI) PCBs, there has been a surge in demand for the localization and surface verification of micron and even nanometer-level defects.
The chip packaging industry is at a crossroads in the “post-Moore’s Law era.” Based on the latest information from multiple authoritative organizations and industry leaders for 2024-2025, the future development trends over the next 5-7 years can be summarized with “six key terms + three roadmaps.” Keyword 1: System-Level Ultra-Large Packaging (SLP/CoPoS) • In 2025, … Read more
Continuing from the previous discussion, we previously conducted an in-depth analysis of the upstream materials and chip design industry in China, recommending companies with potential for the future. In this issue, we will discuss the current state of China’s chip packaging industry. The Chinese chip packaging industry is currently at a bottleneck in development. Some … Read more