Recently, MediaTek announced a significant milestone: their first flagship chip based on TSMC’s 2nm process has completed tape-out. In simple terms, this means the chip design is finished, and it is now entering the “real-world testing” phase—specifically, the manufacturing verification stage. More importantly, they stated: this chip is planned to enter mass production by the … Read more
MediaTek has announced that its first flagship SoC using TSMC’s 2nm process has officially taped out, with a target for mass production by the end of 2026. The industry widely speculates that this could be the next-generation Dimensity (also known as Dimensity 9600). This news is not only significant for the smartphone industry but will … Read more
On September 16, MediaTek announced that its first flagship SoC based on TSMC’s 2nm process technology has successfully completed the design tape out, and is expected to enter mass production and be launched by the end of 2026, making it one of the first companies to adopt this advanced process. Although the official product name … Read more
Japan’s Rapidus has successfully taped out a 2 nanometer GAA test chip, with plans for mass production in 2027, utilizing ASML‘s EUV tools for manufacturing. This node has achieved all the required electrical characteristics set initially, with the IIM-1 fab expected to produce about 25,000 wafers per month. By 2027, Rapidus aims to fall behind … Read more
The following question was asked by a VIP student from the Cortex-A72 training camp: After completing the single-core CPU PR, how do I output the data to TOP for multi-core hierarchy integration? Answer: After completing the single-core CPU, you need to output library files such as SDC, DEF, LEF, GDS, Netlist, LIB, etc., and then … Read more
On August 27, news emerged from the recently concluded Hot Chips 2025 conference that the Japanese semiconductor company Rapidus announced the successful completion of 2nm GAA (Gate-All-Around) test chip tape-out (note: the actual tape-out was successfully completed on July 10), with plans for mass production in 2027. The 2nm chip is based on ASML extreme … Read more
~Q Group Chat [AMP Lab Kitchen: 679837318]~It’s best if it’s trueAt the recently concluded Hot Chips 2025 conference, Japanese semiconductor company Rapidus announced the successful completion of the 2nm GAA (Gate-All-Around) test chip taping (which actually occurred on July 10), and plans to achieve mass production by 2027.The 2nm chip is manufactured using ASML’s extreme … Read more
Follow “Electronic Engineering Magazine” and add the editor on WeChat Regional groups are now open, please send messages 【Shenzhen】【Shanghai】【Beijing】【Chengdu】【Xi’an】 to the public account As semiconductor technology enters the 2nm era, a global race for technological breakthroughs, market positioning, and commercial implementation is underway. In July 2025, MediaTek announced that its 2nm chip will complete tape-out … Read more
This article is reprinted from: IT Home, Author: Wang Miao Loongson Technology revealed at today’s performance briefing that the Loongson 3A6000 PC processor will obtain samples in the first half of 2023. In addition, the 3A5000 + 7A2000 for desktop applications and the 3C5000 + 7A2000 for server applications have completed productization, supporting industry chain … Read more
Follow “Electronic Engineering Magazine” and add the editor’s WeChat Regional groups are now open, please send a message with 【Shenzhen】【Shanghai】【Beijing】【Chengdu】【Xi’an】 to the public account By 2026, approximately one-third of flagship smartphone SoCs globally will adopt 3nm or 2nm process technology, a trend driven by major suppliers such as Apple, Qualcomm, and MediaTek. Recently, market research … Read more