Samsung’s Chip Manufacturing Division to Produce Qualcomm’s Next-Generation Flagship Processor

Samsung's Chip Manufacturing Division to Produce Qualcomm's Next-Generation Flagship Processor

Click the blue text above 【AnTuTu】 to follow meSharing technology hotspots every day! Recently, South Korean media reported that Samsung’s semiconductor foundry division is negotiating with Qualcomm to mass-produce a 2nm mobile application processor (AP), specifically the Qualcomm Snapdragon 8 Elite Gen 2. According to South Korean media, the Qualcomm Snapdragon 8 Elite Gen 2 … Read more

Rapidus Provides Version 0.5 of 2nm PDK, Tenstorrent Aims for Tape-out of Collaborative Chip This Year

Rapidus Provides Version 0.5 of 2nm PDK, Tenstorrent Aims for Tape-out of Collaborative Chip This Year

On April 21, news emerged that AI chip company Tenstorrent held the opening ceremony of its Tokyo office on the 17th of this month. The company’s CEO and renowned chip designer Jim Keller attended the event in Japan and also visited its partner Rapidus located in Hokkaido. During a press conference, Jim Keller stated that … Read more

AMD’s New EPYC Processor Completes Tape-Out, Utilizing TSMC’s 2nm Process

AMD's New EPYC Processor Completes Tape-Out, Utilizing TSMC's 2nm Process

On April 14 local time, AMD announced that its next-generation Zen 6 EPYC processor “Venice” has officially completed tape-out, becoming the industry’s first high-performance computing (HPC) processor to utilize TSMC’s 2nm (N2) process technology. AMD stated that this marks a significant breakthrough in the collaboration between AMD and TSMC on advanced process technology, demonstrating both … Read more

Milestone! The World’s First 2nm HPC Processor Completes Tape-Out and Successfully Powers On!

Milestone! The World's First 2nm HPC Processor Completes Tape-Out and Successfully Powers On!

AMD announced late Monday that it has achieved its first 2nm chip, which is the core complex die of its 6th generation EPYC “Venice” processor (core complex die (CPU)), and this processor is expected to launch next year. The “Venice” core complex die is the industry’s first high-performance computing (HPC) central processing unit design that … Read more

PC Chip Landscape Shifts: AMD Completes 2nm Chip Taping Out, Intel Faces Two Major Dilemmas

PC Chip Landscape Shifts: AMD Completes 2nm Chip Taping Out, Intel Faces Two Major Dilemmas

When you feel challenged, think of Intel! On April 14, 2025, at TSMC’s headquarters in Hsinchu, AMD CEO Dr. Lisa Su and TSMC Chairman Dr. C.C. Wei held a wafer the size of a fingernail, announcing a groundbreaking news in the industry—the world’s first 2nm high-performance computing chip, Zen6 EPYC Venice, has completed its tape-out. … Read more