Assistance with 1.4nm Chip Flexible Substrate Technology

Assistance with 1.4nm Chip Flexible Substrate Technology

1.4nm ChipFlexible Substrate 1. SiO₂ nanoparticle doping rate (5-20wt%) 2. Nanocellulose diameter (10-15nm) 3. Metal oxide layer thickness (0.5-2nm) 4. Organic-inorganic hybrid interface density (10³/cm²) Micro composition (10 items) 5. Ultra-thin silicon layer lattice defect density (<10⁵/cm²) 6. Flexible polymer chain orientation (>80%) 7. Nanowire conductive network porosity (5-30%) 8. Stress buffer layer Young’s modulus … Read more