~Q Group Chat [AMP Lab Kitchen: 679837318]~It’s best if it’s trueAt the recently concluded Hot Chips 2025 conference, Japanese semiconductor company Rapidus announced the successful completion of the 2nm GAA (Gate-All-Around) test chip taping (which actually occurred on July 10), and plans to achieve mass production by 2027.
The 2nm chip is manufactured using ASML’s extreme ultraviolet (EUV) lithography, and the node process has met all preset electrical performance indicators. In 2027, Rapidus’s IIM-1 factory is expected to achieve a monthly capacity of 25,000 wafers.
Additionally, Rapidus introduced the development goals of the IIM-1 factory and its appeal to potential customers at the Hot Chips conference. Compared to TSMC and possibly Intel, Rapidus’s process level in 2027 will lag by one to two nodes. The company aims to achieve differentiation through production flexibility:
Single wafer process concept: The cycle from design to wafer completion can be shortened to 50 days, while traditional batch-single wafer hybrid processes typically require about 120 days.
Rapid delivery: To meet urgent demands for specific products, the standard delivery cycle is 50 days, and Rapidus promises a 15-day wafer delivery at the 2nm node, which is unprecedented in the industry.
Rapidus stated that this model relies on customized backend processes, combined with OSAT, EDA, IP, R&D, and material supply chains, to achieve rapid taping and delivery.
In less than three years, Rapidus has completed major milestones for the IIM-1 factory: groundbreaking in September 2023, and installation and connection of over 200 advanced semiconductor devices by June 2025.
Rapidus’s execution capability will be a key indicator. Currently, the company’s vision has a certain degree of credibility, but the semiconductor manufacturing industry is complex and ever-changing, and many plans may not be fully realized on schedule, so the outside world is still closely monitoring its progress.
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