This article is compiled by Semiconductor Industry Insights (ID: ICVIEWS).By 2025, 3nm will become the dominant node for all new flagship SoCs. According to Counterpoint’s latest “Global AP-SoC Long-term Forecast,” leading nodes (3nm and 2nm) will account for about one-third of smartphone SoC shipments in 2026. Apple is the first smartphone OEM to adopt TSMC’s … Read more
On June 24, market research firm Counterpoint Research released its report titled “Global Mobile Processor (AP-SoC) Node Long-Term Forecast,” stating that by 2026, one-third of flagship smartphones globally will adopt advanced process technologies of 3nm or 2nm. The report indicates that Apple will be the first to introduce TSMC’s 3nm A17 Pro chip in the … Read more
Click the blue text above 【AnTuTu】 to follow meSharing technology hotspots every day! Recently, South Korean media reported that Samsung’s semiconductor foundry division is negotiating with Qualcomm to mass-produce a 2nm mobile application processor (AP), specifically the Qualcomm Snapdragon 8 Elite Gen 2. According to South Korean media, the Qualcomm Snapdragon 8 Elite Gen 2 … Read more
On April 21, news emerged that AI chip company Tenstorrent held the opening ceremony of its Tokyo office on the 17th of this month. The company’s CEO and renowned chip designer Jim Keller attended the event in Japan and also visited its partner Rapidus located in Hokkaido. During a press conference, Jim Keller stated that … Read more
On April 14 local time, AMD announced that its next-generation Zen 6 EPYC processor “Venice” has officially completed tape-out, becoming the industry’s first high-performance computing (HPC) processor to utilize TSMC’s 2nm (N2) process technology. AMD stated that this marks a significant breakthrough in the collaboration between AMD and TSMC on advanced process technology, demonstrating both … Read more
AMD announced late Monday that it has achieved its first 2nm chip, which is the core complex die of its 6th generation EPYC “Venice” processor (core complex die (CPU)), and this processor is expected to launch next year. The “Venice” core complex die is the industry’s first high-performance computing (HPC) central processing unit design that … Read more
When you feel challenged, think of Intel! On April 14, 2025, at TSMC’s headquarters in Hsinchu, AMD CEO Dr. Lisa Su and TSMC Chairman Dr. C.C. Wei held a wafer the size of a fingernail, announcing a groundbreaking news in the industry—the world’s first 2nm high-performance computing chip, Zen6 EPYC Venice, has completed its tape-out. … Read more