The Competition Between Gate-All-Around (GAA) and Buried Power Distribution Network (BSPDN) Technologies at the 2nm Node

The Competition Between Gate-All-Around (GAA) and Buried Power Distribution Network (BSPDN) Technologies at the 2nm Node

Fundamentals of Buried Power Distribution Network (BSPDN) In addition to Gate-All-Around (GAA) transistors, BSPDN is another key innovation in next-generation logic process technology. In all current digital logic process technologies, transistors are first fabricated on the wafer, followed by the creation of dozens of metal layers that power the transistors and transmit signals between them … Read more

Rapidus 2HP Claims to Surpass Intel’s 18A Logic Density Affected by BSPDN, Rivals TSMC

Rapidus 2HP Claims to Surpass Intel's 18A Logic Density Affected by BSPDN, Rivals TSMC

According to sources cited by Wccftech, the Japanese semiconductor company Rapidus is preparing its advanced 2nm process node, named “2HP,” which is expected to achieve logic density comparable to TSMC’s N2 and significantly surpass Intel’s 18A. Reportedly, the logic density of Rapidus’s 2HP node will reach 237.31 MTr/mm², which is nearly on par with TSMC’s … Read more

Rapidus Announces Completion of 2nm GAA Test Chip: Plans for Mass Production in 2027 with Monthly Capacity Expected to Reach 25,000 Wafers

Rapidus Announces Completion of 2nm GAA Test Chip: Plans for Mass Production in 2027 with Monthly Capacity Expected to Reach 25,000 Wafers

On August 27, news emerged from the recently concluded Hot Chips 2025 conference that the Japanese semiconductor company Rapidus announced the successful completion of 2nm GAA (Gate-All-Around) test chip tape-out (note: the actual tape-out was successfully completed on July 10), with plans for mass production in 2027. The 2nm chip is based on ASML extreme … Read more

Japanese Semiconductor Company Rapidus Announces Completion of 2nm Chip Taping, Plans for Mass Production in 2027

Japanese Semiconductor Company Rapidus Announces Completion of 2nm Chip Taping, Plans for Mass Production in 2027

~Q Group Chat [AMP Lab Kitchen: 679837318]~It’s best if it’s trueAt the recently concluded Hot Chips 2025 conference, Japanese semiconductor company Rapidus announced the successful completion of the 2nm GAA (Gate-All-Around) test chip taping (which actually occurred on July 10), and plans to achieve mass production by 2027.The 2nm chip is manufactured using ASML’s extreme … Read more

Observations on Semiconductor Industry Trends

Observations on Semiconductor Industry Trends

1. Challenging 5nm Single Exposure! ASML Collaborates with Zeiss to Develop Next-Generation Hyper NA EUV Equipment On June 29, it was reported thatthe world’s largest semiconductor equipment leader ASML has begun developing the next-generation Hyper NA EUV advanced lithography machine, preparing for the chip industry over the next decade.The company’s Technical Executive Vice President Jos … Read more

The World’s First 3nm Chip is Here! Not TSMC, Sparking a Stir in the Tech Community – How Difficult is High-End Semiconductor Chip Production?

The World's First 3nm Chip is Here! Not TSMC, Sparking a Stir in the Tech Community - How Difficult is High-End Semiconductor Chip Production?

The world’s first 3nm chip has been born, surprisingly not led by TSMC, sparking heated discussions in the tech community. Will TSMC’s dominant position in technology face its final chapter? According to relevant media reports, Samsung’s fully wrapped gate 3nm chip has officially debuted. As the first company to break the industry’s technological ceiling, Samsung … Read more

Another Breakthrough: Successful Tape-Out of 2nm Chip

Another Breakthrough: Successful Tape-Out of 2nm Chip

Another Breakthrough: Successful Tape-Out of 2nm Chip In this rapidly evolving technological era, every step of innovation has the potential to change the landscape of the entire industry. Recently, a groundbreaking achievement by World Semiconductor has undoubtedly injected a shot of adrenaline into the global semiconductor industry — they have successfully tape-out the world’s first … Read more