A certain audio product’s PCBA (wave soldering process) experienced burning during use. The failure rate was high when using Flux A, slightly decreased after cleaning, and dropped to zero after switching to Flux B. This article will explore the failure reasons through a series of professional testing and analysis methods. 1. Visual Analysis From visual … Read more
Wu Zheming, Ge Hongjuan, Hu Yinxiao, Pan Shuyue, Jin Hui, Sang Yiqin (Nanjing University of Aeronautics and Astronautics, Civil Aviation College, Nanjing, Jiangsu 211106, China) doi: 10.19708/j.ckjs.2022.07.283 Citation format: Wu Zheming, Ge Hongjuan, Hu Yinxiao, et al. Component Failure Correlation Analysis of Multi-Electric Aircraft Starter Generator System Based on DEMATEL [J]. Measurement and Control Technology, … Read more
😶🌫️ Always staring at the phone So dizzy! 😇 Click 🎧 to listen and let’s sharpen our ears together 👂 How to unveil the “black box” of a chip without damaging the silicon wafer? Chip decapsulation is a critical step in failure analysis, requiring precise removal of packaging materials at the micron scale while protecting … Read more