A chip typically goes through five major stages and over 20 key steps from “sand” to “power on.” Below is a “high-speed rail timetable” to help you quickly understand the entire industry chain: Stage1 Design (0→1, turning algorithms into blueprints) StepCore Tools/OutputOne-sentence Explanation 1. Requirement DefinitionMarket/Customer SpecFirst define“how many Hz, how many cores, power < … Read more
Professional Terminology in the PCB Industry (A-C) DDate Code Production DateRefers to the production date of the product, usually expressed in a 4-digit format (YY+WW), presented on the board through etching or printing, and typically displayed alongside the company logo and UL certification for identification or subsequent traceability.DES (Development–Etching–Stripping) is an abbreviation for development-etching-stripping, a … Read more
This work is an original creation based on the author’s personal work experience and independent understanding. All content is the result of the author’s intellectual labor. Any form of reproduction, distribution, publication, adaptation, or commercial use without explicit written authorization from the author is considered an infringement and will be pursued legally. This is a … Read more
Source: Learning About Things Original Author: Xiao Chen Po Po This article introduces the five typical failure modes in chip packaging: gold wire displacement, chip cracking, interface cracking, substrate cracking, and reflow soldering defects. In the field of integrated circuit packaging failure analysis, gold wire displacement, chip cracking, interface cracking, substrate cracking, and reflow soldering … Read more
Drop testing is a critical step in assessing the mechanical reliability of a product, and its reliability is largely determined during the PCB design and manufacturing stages. The success or failure of drop testing is related to PCB design, PCB manufacturing, and PCBA operations, and this article will elaborate on these three aspects. ★ PCBA … Read more
Advertisement Divider PCB Network City News Professor Bai Rongsheng is well-known in the industry and has been writing articles related to circuit boards and their upstream and downstream since 1988. He has published more than ten professional books including “The Complete Book on PCB Wet Processes”, “PCB and Lead-Free Soldering”, “PCB Terminology Handbook”, “PCB Terminology … Read more
The reliability testing and failure analysis of PCB / PCBA proceed hand in hand; when design pressures reach their limits, thorough inspection and analysis are needed to determine their failure modes. Some of these tests and potential failure causes are handled by manufacturers, as they may arise during the bare board manufacturing process, while other … Read more
A certain audio product’s PCBA (wave soldering process) experienced burning during use. The failure rate was high when using Flux A, slightly decreased after cleaning, and dropped to zero after switching to Flux B. This article will explore the failure reasons through a series of professional testing and analysis methods. 1. Visual Analysis From visual … Read more
Wu Zheming, Ge Hongjuan, Hu Yinxiao, Pan Shuyue, Jin Hui, Sang Yiqin (Nanjing University of Aeronautics and Astronautics, Civil Aviation College, Nanjing, Jiangsu 211106, China) doi: 10.19708/j.ckjs.2022.07.283 Citation format: Wu Zheming, Ge Hongjuan, Hu Yinxiao, et al. Component Failure Correlation Analysis of Multi-Electric Aircraft Starter Generator System Based on DEMATEL [J]. Measurement and Control Technology, … Read more
😶🌫️ Always staring at the phone So dizzy! 😇 Click 🎧 to listen and let’s sharpen our ears together 👂 How to unveil the “black box” of a chip without damaging the silicon wafer? Chip decapsulation is a critical step in failure analysis, requiring precise removal of packaging materials at the micron scale while protecting … Read more