In the process of PCB manufacturing and soldering, the issue of solder balls or solder ball blockage in solder mask vias is a common yet troublesome problem. Solder balls not only affect the aesthetic quality of the product but can also lead to circuit shorts, severely impacting the reliability and lifespan of the product. Today, … Read more
PCB component layout is not a matter of personal preference; it follows certain rules that must be adhered to. In addition to general requirements, some special components have different layout requirements. Layout Requirements for Crimping Components 1) For crimping components with bent male/female pins, there must not be any components higher than 3mm within 3mm … Read more
📌 Problem Overview BGA components are prone to deformation during the reflow soldering process due to high thermal stress. This deformation can lead to poor contact between BGA solder balls and pads, resulting in cold solder joints, short circuits, or solder joint fractures due to stress concentration in later usage. The following table summarizes the … Read more
Source: Learning About Things Original Author: Xiao Chen Po Po This article introduces the five typical failure modes in chip packaging: gold wire displacement, chip cracking, interface cracking, substrate cracking, and reflow soldering defects. In the field of integrated circuit packaging failure analysis, gold wire displacement, chip cracking, interface cracking, substrate cracking, and reflow soldering … Read more
ABC Sharing Session Theme Sharing Information Review: Sharing Topic: Introduction to SMT Process and Costs Sharing Time: May 10, 2019 Presenter: Xiao Gang Recorder: Jiang Huai Commentators: Jian, Ya Qiong Article Editor: Li Gongzi Partial Content of the Sharing PPT (Jiang Huai): SMT is the most popular production process in the electronics assembly industry, meeting … Read more
Reflow Soldering Reflow soldering is an important soldering technology in the field of electronic manufacturing, primarily used to solder surface mount devices (SMD) onto printed circuit boards (PCB). The basic principle of reflow soldering: The core principle of reflow soldering is to re-melt the solder paste (a mixture of solder and flux) that is pre-distributed … Read more
During the reflow soldering process, circuit boards are often prone to warping and bending. In severe cases, this can lead to issues such as cold solder joints and component misalignment. How can we overcome these challenges? 1. The Dangers of PCB Deformation In automated surface mount lines, if the circuit board is not flat, it … Read more
1 Tools for Manual Soldering Any electronic product, from a rectifier made up of a few components to a computer system composed of thousands of parts, is constituted by basic electronic components and functions, connected according to circuit principles using specific techniques.Although there are various connection methods (e.g., wrapping, crimping, adhesive), the most widely used … Read more
Search WeChat Technical Training Comparison of Breadboards and Universal Boards Welding Methods for Universal Boards For the layout of components on the universal board, most people are accustomed to “following the clues,” centering around key components like chips and inserting other components wherever possible. This method reflects order in the chaos of soldering, and is … Read more
Error Proofing and Foolproofing (Industrial Design Case Sharing) (Click the above blue text to obtain learning materials!) （High Transparency Soldering Case – Automotive Control Products） Source:Electronic Manufacturing Process Technology http://www.dianzichanye.com Recommended Reading Decoding Foxconn IE Seven Practical Techniques of IE Introduction to Gas Tightness Testing Technology Classification and Application of Water-Based Cleaners IPC-A-610G Standard Training … Read more