Click on the arrow “China Electroplating Network” , follow us 1. Plating of Flexible Circuit Boards (FPC) (1) Pre-treatment for FPC Plating: The copper conductor surface exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration caused by high-temperature … Read more
Author Author Happy Holden has been specializing in printed circuit technology since 1970, working for companies such as HP, NanYa Westwood, Merix, Foxconn, and Gentex. Currently, Happy serves as the technical editor for I-Connect007 magazine and is the author of “Automation and Advanced Processes in Printed Circuit Manufacturing” and “25 Essential Skills for Electronic Engineers”. … Read more
With the rapid development of the PCB industry, PCBs are gradually moving towards high-precision fine lines, small apertures, and high aspect ratios (6:1-10:1). The copper requirement for holes is 20-25μm, and for boards with DF line spacing ≤ 4 mil, most PCB manufacturers face plating adhesion issues. Adhesion can cause direct short circuits, affecting the … Read more
Introduction: In the previous article, we introduced the manufacturing process of PCBs, but we would like to delve deeper into the aspects of via copper thickness and the aspect ratio of PCB vias. Definition of PCB Copper Thickness The thickness of copper in a circuit is measured in ounces (oz). So, why is thickness expressed … Read more
Click on the arrow “China Electroplating Network” , follow us There are four main methods of electroplating in circuit boards: finger-type electroplating, through-hole electroplating, roller-type selective plating, and brush plating. Here is a brief introduction: 1 Finger-type Electroplating This method requires rare metals to be plated on the edge connectors, protruding contacts, or gold fingers … Read more
1.Flexible Circuit Board Plating (1) Pre-treatment for FPC Plating: The surface of the copper conductors exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration due to high-temperature processes. To achieve a tightly bonded plating layer with good adhesion, … Read more
As the precision of PCB circuit board line production increases, issues of open and short circuits during line production have become significant factors affecting product qualification rates. Typically, actions to improve line qualification rates consider factors such as dry film adhesion and exposure energy. From the perspective of the entire system’s production, the flatness of … Read more
For more details, please log in to www.cpcashow.com Process control is often overlooked by the industry, yet it is crucial for the successful operation of PCB factories. This involves controlling the concentration of chemicals in numerous PCB processes, especially in rapidly developing automated processes. I have a knack for analysis, which is why I am … Read more