PCB Manufacturing Industry Terminology (Part II): Common PCB Surface Treatment Processes, Their Advantages, Disadvantages, and Applicable Scenarios

PCB Manufacturing Industry Terminology (Part II): Common PCB Surface Treatment Processes, Their Advantages, Disadvantages, and Applicable Scenarios

After designing the PCB, we send it to the PCB manufacturer for prototyping or mass production. When placing an order with the manufacturer, we include a PCB processing technology specification document, which specifies the type of PCB surface treatment process to be used. Different PCB surface treatment processes can significantly affect the final PCB processing … Read more

Knowledge of Surface Plating for Flexible Circuit Boards

Knowledge of Surface Plating for Flexible Circuit Boards

1.Flexible Circuit Board Plating   (1) Pre-treatment for FPC Plating: The surface of the copper conductors exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration due to high-temperature processes. To achieve a tightly bonded plating layer with good adhesion, … Read more

Application of Multi-functional CNC Dual-station Quenching Machine Tool

Application of Multi-functional CNC Dual-station Quenching Machine Tool

Authors: Zhang Xiaoyang, Wang Shanshan, Li Ping Affiliation:China Nonferrous (Shenyang) Metallurgical Machinery Co., Ltd. Source: “Metal Processing (Thermal Processing)” Magazine The multi-functional CNC dual-station quenching machine tool was developed and designed by the manufacturer in collaboration with our company’s technical personnel, based on the diversified characteristics of our products and the requirements for quenching machine … Read more

Why Use Gold Plating and Immersion Gold on PCBs? Differences Explained

Why Use Gold Plating and Immersion Gold on PCBs? Differences Explained

1. PCB Surface Treatment The surface treatment processes for PCBs include: anti-oxidation, tin spraying, lead-free tin spraying, immersion gold, immersion tin, immersion silver, hard gold plating, full board gold plating, gold fingers, nickel-palladium gold OSP, etc. The main requirements are: low cost, good solderability, strict storage conditions, short time, environmentally friendly processes, good soldering, and … Read more