Today, we continue to introduce the basics of the plating process in PCB/HDI manufacturing, following Part 2; this is Part 3. First, let’s introduce a few typical blind hole structures: The above case is a 2-layer HDI board with 8 layers, where layers L3-L6 are designed with buried holes, and layers L1/L2, L2/L3 and L6/L7, … Read more
Continuing from the first part, we will further introduce the basics of HDI plating. 4.3.2 Plasma – Key Control Points: 4.3.3 Plasma – Quality Inspection: 4.4.1 Copper Deposition – Subprocess Function: By using swelling to remove the drilling debris inside the holes, the charge inside the holes is adjusted to deposit activated palladium ions, which … Read more
1. Surface Plating of Flexible Printed Circuit Boards (FPC) (1) Pre-treatment for FPC Plating: The copper conductor surface exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration caused by high-temperature processes. To achieve a tightly adhered plating layer, … Read more
Click on the arrow “China Electroplating Network” , follow us 1. Plating of Flexible Circuit Boards (FPC) (1) Pre-treatment for FPC Plating: The copper conductor surface exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration caused by high-temperature … Read more
1.Flexible Circuit Board Plating (1) Pre-treatment for FPC Plating: The surface of the copper conductors exposed after the coating process of the flexible printed circuit board (FPC) may be contaminated with adhesives or inks, and may also have oxidation or discoloration due to high-temperature processes. To achieve a tightly bonded plating layer with good adhesion, … Read more