Development of Printed Circuit Boards (PCBs) and Multilayer Board Manufacturing Technology

Development of Printed Circuit Boards (PCBs) and Multilayer Board Manufacturing Technology

Click the blue text to follow us Printed Circuit Boards In the early 20th century, Paul Eisler first proposed the concept of “printed circuits” and developed the world’s first printed circuit board (PCB). As the most widely used substrate in secondary electronic packaging technology, it is a substrate covered with single or multiple layers of … Read more

Detailed Introduction to PCB Plating Processes

Detailed Introduction to PCB Plating Processes

A PCB (Printed Circuit Board) is a board made of insulating material, designed to create conductive patterns for electrical connections between components. The conductive patterns formed on the insulating substrate are referred to as printed circuits. Thus, the finished board is called a printed circuit board, also known as a printed board or PCB. PCBs … Read more

Introduction to PCB Electroplating Process

Introduction to PCB Electroplating Process

Click on the arrow “China Electroplating Network” , follow us The electroplating process of printed circuit boards can be classified into: acidic bright copper plating, nickel/gold plating, and tin plating. This article introduces the technology and process flow of the electroplating process during PCB manufacturing, as well as specific operational methods. II. Process Flow: Acid … Read more

From Electroplating Solutions to Photoresists: The Platformization and Advancement of Semiconductor Material Layout

From Electroplating Solutions to Photoresists: The Platformization and Advancement of Semiconductor Material Layout

Development History Shanghai Xinyang was established in July 1999 and was listed on the Shenzhen Stock Exchange’s Growth Enterprise Market in 2011. The company is headquartered in the Songjiang District of Shanghai and focuses on the research and development, manufacturing, and sales of functional chemical materials and application technologies required by the semiconductor industry, committed … Read more

10-Layer First-Level HDI PCB Manufacturing Process and Technical Points

10-Layer First-Level HDI PCB Manufacturing Process and Technical Points

10-Layer First-Level HDI PCB Manufacturing Process and Technical Points 1. Definition and Features of 10-Layer First-Level HDI Board The 10-Layer First-Level HDI (High-Density Interconnect) board is a type of multi-layer PCB that uses blind hole technology to connect the outer and inner layers, structured as 1+8+1, which means 1 outer layer, 8 inner layers, and … Read more

How to Solve PCB Plating Film Issues?

How to Solve PCB Plating Film Issues?

With the rapid development of the PCB industry, PCBs are gradually moving towards high-precision fine lines, small apertures, and high aspect ratios (6:1-10:1). The copper requirement for holes is 20-25μm, and for boards with DF line spacing ≤4 mil, most PCB manufacturers face plating film issues. Film entrapment can cause direct short circuits, affecting the … Read more

PCB Equipment Manufacturers: The Gold Diggers of the Industry

PCB Equipment Manufacturers: The Gold Diggers of the Industry

1. The surge in AI computing power demand drives the need for high-end PCBs, with domestic mainstream manufacturers actively expanding production. 1) Computing power demand: Against the backdrop of sustained high computing power demand from AIGC and others, the global server market is entering a new growth cycle starting in 2024. IDC predicts that from … Read more

How to Solve the Plating Adhesion Issues in PCBs?

How to Solve the Plating Adhesion Issues in PCBs?

With the rapid development of the PCB industry, PCBs are gradually moving towards high-precision fine lines, small apertures, and high aspect ratios (6:1-10:1). The copper requirement for holes is 20-25μm, and for boards with a D/F line spacing of ≤4 mil, most PCB manufacturers face plating adhesion issues. Adhesion can cause direct short circuits, affecting … Read more

Empowering the PCB Industry: Tackling High Energy Consumption in Electroplating

Empowering the PCB Industry: Tackling High Energy Consumption in Electroplating

Under the “dual carbon” strategic goals, the PCB (Printed Circuit Board) manufacturing industry, as a cornerstone of the electronic information industry, is facing severe energy consumption challenges, and the green transformation of PCB manufacturing is urgent. Industry data shows that the electroplating process, as a core energy-consuming segment, accounts for about 30%-40% of total production … Read more

PCB Equipment Industry Insights: Rising Demand for Computing Power and Emerging New Technologies

PCB Equipment Industry Insights: Rising Demand for Computing Power and Emerging New Technologies

Click↑↑↑「Blue Text」 to follow our official accountEditor An An’s private account: dianduquan (This image is unrelated to the promotion and article) (Source: Advanced Manufacturing New Perspective) Investment Rating: Buy (Maintain) 1 Rising demand for computing power drives capital expenditure in the PCB industry According to IDC data, global server sales are expected to reach $95.2 … Read more