Institutional Insights· Research Reference Join the Community· WeChat: Buddha_Research Summary of Content What is the overall report content today? What are the main driving forces behind the downstream value of PCBs? Today’s report provides a detailed logical overview of the drilling segment, while also summarizing some aspects of PCB logic. Currently, the core trend in … Read more
Institutional Insights· Research Reference Join the Community· WeChat: Buddha_Research Summary of Content What is the main theme of today’s report? What are the core trends in the PCB industry? Today’s report focuses on the drilling aspect, providing a detailed logical analysis and briefly reviewing the basic situation of the PCB industry, especially the development trends … Read more
Multilayer Precision Impedance Blind Hole PCBs: Which Quality Service Provider to Choose? In modern electronic products, the application of multilayer precision impedance blind hole PCBs is becoming increasingly widespread, especially in fields such as communication equipment, computers, medical devices, and high-end consumer electronics. However, with numerous PCB manufacturers in the market, choosing a quality service … Read more
Previously, I introduced the core raw materials upstream of PCB and CCL, such as electronic fiberglass, electronic resin, copper foil, etc. I also discussed the industry situation of PCBs. I believe everyone has a certain understanding of this industry. If interested, you can refer back to the previous articles~~ Trends in Core PCB Equipment Development … Read more
(This article is organized by AI for reference only, please delete if infringing) 1. Overview of NVIDIA’s Rubin CPX New Solution Positioning: A new solution positioned between the original Rubin and Rubin Ultra, officially named Rubin NV144 CPX. Configuration: Each cabinet integrates 36 CPUs + 144 GPUs, with an additional 144 CPX dedicated inference chips. … Read more
10-Layer First-Level HDI PCB Manufacturing Process and Technical Points 1. Definition and Features of 10-Layer First-Level HDI Board The 10-Layer First-Level HDI (High-Density Interconnect) board is a type of multi-layer PCB that uses blind hole technology to connect the outer and inner layers, structured as 1+8+1, which means 1 outer layer, 8 inner layers, and … Read more
Recently, the public account has changed its rules, and articles are no longer pushed in chronological order. If you don’t want to miss articles from the “Thinking Summary Account“, please set it as a “star” and frequently click “See”. Thank you for your support! This public account is a backup account for the “Thinking Summary … Read more