1. Purpose To standardize the appearance inspection operations of PCBA (Printed Circuit Board Assembly), ensuring that the production process and final product quality meet specified requirements, this standard has been established. 2. Scope of Application 2.1 This standard applies to the appearance inspection of all self-produced and outsourced PCBA products of this company (except as … Read more
Table of Contents [CH.1]: Shallow Trench Isolation (STI) Gapfill Defects [CH.2]: Seam Defects [CH.3]: Particle-Induced Defects [CH.4]: Deposition Uniformity Defects [CH.5]: Silicide Encroachment / Silicide Stringer Defects [CH.6]: Overhang Defects [CH.7]: Poor Step Coverage Defects [CH.8]: Cracking Defects in Insulating Films [CH.9]: Gate Oxide Thinning Defects [CH.10]: Not Open Defects [CH.1] Shallow Trench Isolation (STI) … Read more
Table of Contents [CH.1]: Shallow Trench Isolation (STI) Gapfill Defects [CH.2]: Seam Defects [CH.3]: Defects Caused by Particles [CH.4]: Deposition Uniformity Defects [CH.5]: Silicide Encroachment / Silicide Stringer Defects [CH.6]: Overhang Defects [CH.7]: Poor Step Coverage Defects [CH.8]: Cracking Defects in Insulating Films [CH.9]: Gate Oxide Thinning Defects [CH.10]: Not Open Defects [CH.1] Shallow Trench … Read more
Crystal Structure Crystals can be divided into single crystals and polycrystals. If the atoms in the entire material are arranged in a regular and periodic manner, with a single structure throughout, it is called a single crystal, such as quartz single crystals, silicon single crystals, and rock salt single crystals. Polycrystals are made up of … Read more
Follow 👆 The Modern Electronic Assembly Technology Exchange Platform👆 Select “Pin/Star” Let’s learn and improve together! Master Electronics 2024 Annual Training Plan Teacher Cong Phone: 13810257238 (WeChat) Click the title link below ↓ ↓ ↓ to enter course details Master Electronics 2024 Annual Training Plan, welcome to collect and share! PPT Collection Document Directory 1. … Read more
Click the Blue Text Above | Follow Us The wave soldering process of PCBA components is a major stage that leads to defects, with a defect rate as high as 50% throughout the PCBA assembly process. The defects that occur during wave soldering can be seen as a concentrated manifestation of problems in previous manufacturing … Read more
The edges of printed circuit boards include the outer edge, the inner milled edge, and the edge of non-plated holes, which are one of the items for visual inspection. Common defects include burr, nick, haloing, crazing, delamination, and blister. Burr: Irregular protrusions or edges on the edges of printed boards caused by processes such as … Read more
Follow 👆 Modern Electronic Assembly Process Technology Exchange Platform👆 Select “Pin/Star” to learn together and improve together! Previous Reviews Collection of Assembly Process Documents: ↓ ↓ ↓ Essentials | Selected Assembly Process Document Collection (I): Save it for later! Essentials | Selected Assembly Process Document Collection (II): Save it for later! Essentials | Selected Assembly … Read more