crystal structure

Introduction to Semiconductor Materials: From Crystal Structure to Wafer Birth, Unveiling the ‘Foundational Manufacturing Techniques’ of Chips

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In the chip industry, semiconductor materials are undoubtedly the ‘foundation’, with silicon materials being the core. A qualified wafer undergoes a long journey from crystal structure design to multiple precision processing steps. Today, we will systematically outline the key knowledge of semiconductor materials and understand the complete manufacturing logic from silicon raw materials to wafers. … Read more

Template and Solid-State-Assisted Assembly of an M9L6 Expanded Coordination Cage for Medium-Sized Molecule Encapsulation

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Template and Solid-State-Assisted Assembly of an M9L6 Expanded Coordination Cage for Medium-Sized Molecule Encapsulation

In the mid-1990s, through molecular self-assembly techniques, larger three-dimensional closed cavities were effectively constructed. The M6L4 cage is one of the most efficient self-assembling hosts, formed by the self-assembly of six Pd(II) or Pt(II) 90-degree blocks and four triazine-core triangular ligands, featuring an effective hydrophobic cavity of approximately 450 Å3 capable of encapsulating one or … Read more

Understanding Semiconductor Materials

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Understanding Semiconductor Materials

Crystal Structure Crystals can be divided into single crystals and polycrystals. If the atoms in the entire material are arranged in a regular and periodic manner, with a single structure throughout, it is called a single crystal, such as quartz single crystals, silicon single crystals, and rock salt single crystals. Polycrystals are made up of … Read more

Why Use Gold Plating and Immersion Gold on PCBs? Differences Explained

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Why Use Gold Plating and Immersion Gold on PCBs? Differences Explained

1. PCB Surface Treatment The surface treatment processes for PCBs include: anti-oxidation, tin spraying, lead-free tin spraying, immersion gold, immersion tin, immersion silver, hard gold plating, full board gold plating, gold fingers, nickel-palladium gold OSP, etc. The main requirements are: low cost, good solderability, strict storage conditions, short time, environmentally friendly processes, good soldering, and … Read more