Atomic Layer Deposition

Defect Cases in Semiconductor Evaporation Processes / Common Defect Types in Practice

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Defect Cases in Semiconductor Evaporation Processes / Common Defect Types in Practice

Table of Contents [CH.1]: Shallow Trench Isolation (STI) Gapfill Defects [CH.2]: Seam Defects [CH.3]: Particle-Induced Defects [CH.4]: Deposition Uniformity Defects [CH.5]: Silicide Encroachment / Silicide Stringer Defects [CH.6]: Overhang Defects [CH.7]: Poor Step Coverage Defects [CH.8]: Cracking Defects in Insulating Films [CH.9]: Gate Oxide Thinning Defects [CH.10]: Not Open Defects [CH.1] Shallow Trench Isolation (STI) … Read more

Defect Cases in Semiconductor Evaporation Processes / Common Defect Types in Practice

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Defect Cases in Semiconductor Evaporation Processes / Common Defect Types in Practice

Table of Contents [CH.1]: Shallow Trench Isolation (STI) Gapfill Defects [CH.2]: Seam Defects [CH.3]: Defects Caused by Particles [CH.4]: Deposition Uniformity Defects [CH.5]: Silicide Encroachment / Silicide Stringer Defects [CH.6]: Overhang Defects [CH.7]: Poor Step Coverage Defects [CH.8]: Cracking Defects in Insulating Films [CH.9]: Gate Oxide Thinning Defects [CH.10]: Not Open Defects [CH.1] Shallow Trench … Read more

Unveiling the ‘Embroidery’ Craft of Chip Manufacturing: Atomic-Level Precision in GaN HEMT

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Unveiling the 'Embroidery' Craft of Chip Manufacturing: Atomic-Level Precision in GaN HEMT

In today’s rapidly advancing technological era, chips have become the “heart” driving the digital world. From smartphones to data centers, from new energy vehicles to 5G base stations, ubiquitous chips are becoming smaller and faster. To break through physical limits and meet the increasing integration requirements of Moore’s Law, semiconductor manufacturing is shifting from traditional … Read more