Analysis of Key Factors Causing BGA Voids in Automotive Electronics PCBA SMT Soldering
In surface mount technology (SMT), internal voids in solder joints are one of the main defects affecting the reliability of electronic components. Voids can weaken the mechanical strength, conductivity, and thermal conductivity of solder joints, which may lead to catastrophic failures, especially in high-reliability fields such as automotive electronics and aerospace. This article systematically analyzes … Read more