Today, DecoMicro Electronics (Shenzhen) Co., Ltd. (hereinafter referred to as “DecoMicro”) officially launched the DKT10 series millimeter-wave wireless rotating transceiver chip, aimed at die bonding machines, dispensing machines, wafer mounting equipment, and other precision manufacturing equipment with rotating structures. This chip provides a high-bandwidth, maintenance-free short-range wireless data link solution, helping equipment achieve more stable communication performance under high-speed and high-frequency vibration conditions.In semiconductor packaging equipment such as die bonding machines, the pick-up head, rotating alignment platform, and visual inspection module commonly rely on slip rings or flexible cables for data transmission. However, in environments with prolonged high-acceleration motion, micron-level vibrations, and multi-axis rotation, mechanical contact components are prone to wear, entanglement, breakage, and poor contact, affecting the continuous operation of the equipment and increasing maintenance frequency. The DKT10 series utilizes millimeter-wave wireless communication, maintaining a stable link under 360° continuous rotation, eccentricity, and vibration conditions, with a maximum transmission rate of up to 5Gbps, compatible with various protocols such as USB/Ethernet/LVDS/EtherCAT/CAN/RS485, effectively replacing the limitations of slip rings in terms of bandwidth, lifespan, and reliability.
The newly launched DKT10 series features an Antenna-in-Package (AiP) integrated antenna design, with a circularly polarized antenna structure to adapt to the continuously changing angles and postures during the high-speed rotation of die bonding machines, ensuring more stable coupling efficiency. The highly integrated design reduces the space occupied by wiring, making it more suitable for installation in space-constrained structures such as die bonding heads, rotating alignment platforms, and visual modules. The chip employs a low-power ASK modulation method, providing good resistance to electromagnetic interference, low link latency, and low bit error rate, and supports a wide voltage and temperature range, ensuring reliable communication in the strong interference and long-term continuous operation environments commonly found in semiconductor factories.With its non-contact, high-bandwidth, and maintenance-free characteristics, the DKT10 series can be widely used for data and control signal transmission in critical rotating components of die bonding machines, including real-time position and status data feedback from the pick-up head, high-speed image links for rotating visual modules, angle and motion control signals for alignment systems, and data transmission from various high-speed sensors within the equipment. By reducing the use of slip rings and cables, equipment can further decrease maintenance frequency, improve utilization rates, and achieve smoother process performance in high-speed production lines.As an innovative company in millimeter-wave wireless connectivity and isolation technology, DecoMicro has achieved large-scale production in fields such as LED displays and industrial electronics. The launch of the DKT10 series will further enhance its technological layout in ultra-short-range millimeter-wave communication, providing the semiconductor manufacturing equipment industry with more reliable, compact, and system-value-enhancing wireless rotating communication solutions.For samples and technical information, please contact:[email protected].
Source:DecoMicro
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