Report Title:Market Research and Development Forecast Report on Solder Paste Inspection (SPI) Systems in China (2025-2031)Table of Contents
According to the latest research by QYR, the sales revenue of the solder paste inspection (SPI) system market in China reached ¥ million in 2024, and it is expected to reach ¥ million by 2031, with a compound annual growth rate (CAGR) of % during the period from 2025 to 2031. This research project aims to outline the product series in the solder paste inspection (SPI) system field, gain insights into industry characteristics, market stock space, and incremental space, and assess the positions of various competitors in the solder paste inspection (SPI) system field based on market development prospects.
Solder paste inspection (SPI) is a critical process in the electronic manufacturing industry that ensures the quality and reliability of printed circuit boards (PCBs) before they enter the soldering phase. SPI is a process used in electronic circuit board assembly, involving the inspection of the volume, area, height, and misalignment of solder paste deposits on the PCB before component placement and reflow soldering. This inspection is typically performed using automated optical inspection (AOI) systems or 3D inspection technologies. SPI is a key step in the PCB assembly process, especially in industries where precision and reliability are paramount. It not only enhances the quality of the final product but also saves costs by reducing the need for rework. As electronic products continue to evolve and miniaturize, the role of SPI in maintaining manufacturing standards becomes increasingly important.
The solder paste inspection (SPI) system market is currently in a rapid development phase, driven by the growing demand for high precision and reliability in the electronic manufacturing industry. With the rise of emerging markets such as smartphones, automotive electronics, and Internet of Things (IoT) devices, manufacturers are increasingly focusing on the quality of solder paste printing, leading to an expanded application range of SPI systems. Currently, many companies are adopting advanced inspection technologies, such as 3D imaging and automated analysis, to improve production efficiency and reduce defect rates. Looking ahead, as technology continues to advance and industry standards improve, SPI systems are expected to find applications in a wider range of fields, presenting a broad market outlook.
Key global manufacturers of solder paste inspection (SPI) systems include Koh Young, Test Research, Inc (TRI), Systech, CKD Corporation, and Nordson Corporation, among others. The top five manufacturers account for approximately 61% of the global market share. The Asia-Pacific region is the largest market for solder paste inspection (SPI) systems, holding about 54% of the market share, followed by the Americas and Europe, with approximately 25% and 17% shares, respectively. In terms of product type, online solder paste inspection systems are the largest segment, accounting for about 92% of the share. In terms of downstream applications, consumer electronics is the largest downstream sector, holding about 29% of the share.
This report studies the production, consumption, and import-export situation of solder paste inspection (SPI) systems in the Chinese market, focusing on global and local solder paste inspection (SPI) system manufacturers that play significant roles in the Chinese market. It presents key indicators such as sales volume, revenue, price, gross margin, and market share of these manufacturers in the Chinese market. Additionally, the report provides an in-depth analysis of the segmented growth of solder paste inspection (SPI) system products, including different types of solder paste inspection (SPI) systems, prices, sales volumes, revenues, and market sales of different applications. Historical data covers the years 2020 to 2024, while forecast data spans from 2025 to 2031.
The main solder paste inspection (SPI) system manufacturers covered in this report include:
Koh Young
Test Research, Inc (TRI)
Systech
CKD Corporation
Nordson Corporation
SAKI Corporation
Jintuo Automation
Viscom AG
Mycronic (Vi TECHNOLOGY)
MIRTEC CO., LTD.
PARMI Corp
Zhenhua Xinke
Pemtron
ASC International
ViTrox
Matrix Technology
Jiezhi Technology Co., Ltd.
Caltex Scientific
MEK Marantz Electronics
Zhongwei Intelligent
According to different product types, the categories include:
Online solder paste inspection systems
Offline solder paste inspection systems
According to different applications, the main areas include:
Automotive electronics
Consumer electronics
Industrial
Semiconductors
Others
This report consists of 9 chapters, with the main content of each chapter as follows:
Chapter 1: Report statistical scope, product segmentation, and overall scale of China (sales volume, sales revenue, etc., 2020-2031)
Chapter 2: Competitive analysis of major manufacturers (brands) of solder paste inspection (SPI) systems in the Chinese market, including sales volume, revenue, market share, price, origin, and industry concentration analysis
Chapter 3: Introduction to the basic situation of major manufacturers (brands) of solder paste inspection (SPI) systems in the Chinese market, including company profiles, product models, sales volume, price, revenue, and latest developments
Chapter 4: Sales volume, revenue, price, and share of different product types of solder paste inspection (SPI) systems in China
Chapter 5: Sales volume, revenue, price, and share of solder paste inspection (SPI) systems in different applications in China
Chapter 6: Analysis of the industry development environment
Chapter 7: Supply chain analysis
Chapter 8: Analysis of the production situation of local solder paste inspection (SPI) systems in China, and the import-export situation of solder paste inspection (SPI) systems in the Chinese market
Chapter 9: Report conclusion
Key questions addressed in this report include:
Market space: What is the market size of the solder paste inspection (SPI) system industry in China? What is the future growth outlook?
Industry chain situation: What is the composition of the industry chain for solder paste inspection (SPI) system manufacturers in China? How will the future landscape evolve?
Manufacturer analysis: Who are the leading global manufacturers of solder paste inspection (SPI) systems? What is their situation?
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