Principles and Detection Methods of 3D SPI
SPI (Solder Paste Inspection) refers to the solder paste inspection system, whose main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridging, etc. To quickly and accurately detect extremely small solder paste, detection principles generally use PMP (Phase Modulation Profile Measurement Technology) and Laser (Laser Triangulation … Read more