Fully Automatic Solder Paste Printing (SPI Closed Loop)
How can traditional printing processes break through physical limits under the stringent requirement of a solder paste thickness deviation of only ±15μm? The modern SPI (Solder Paste Inspection) closed-loop system reduces the defect rate from traditional manual sampling of 3500ppm to below 50ppm through 3D laser scanning and real-time feedback control, becoming the first line … Read more