Thermal Resistance

Outstanding Performance at 1500℃! New Breakthrough in High-Performance Ceramic 3D Printing Technology

by
Outstanding Performance at 1500℃! New Breakthrough in High-Performance Ceramic 3D Printing Technology

Recently, the research team led by Professor Huang Zhengren from the Shanghai Institute of Ceramics, Chinese Academy of Sciences, successfully overcame a technical challenge, allowing 3D printed silicon carbide ceramics to maintain excellent performance even at extremely high temperatures, no longer “dropping the ball” due to high temperatures. This breakthrough will provide strong technical support … Read more

Essential Knowledge Points of Circuit Board Materials You Must Pay Attention To

by
Essential Knowledge Points of Circuit Board Materials You Must Pay Attention To

Circuit board materials are mainly divided into FPC flexible boards, FR-4, aluminum substrates, copper substrates (further divided into standard copper substrates and thermoelectric separation copper substrates), and ceramic substrates. This article aims to analyze the design considerations of each type of board material from the perspective of power design, summarized into the following three points: … Read more

The Mechanism of Humidity’s Impact on the Thermal Resistance of Power Semiconductor Chip Solder

by
The Mechanism of Humidity's Impact on the Thermal Resistance of Power Semiconductor Chip Solder

Abstract In recent years, the impact of humidity on the thermal characteristics of power devices has become a hot topic. However, the effect of humidity on the thermal resistance of power device chip solder has not been experimentally verified, and the mechanism remains unclear. This paper proposes, for the first time, the mechanism by which … Read more

Understanding PCB Material Selection

by

Introduction to PCB Materials and Applications 1. What is PCB Material? PCB material, which refers to the substrate material of printed circuit boards, serves as the carrier and interconnection framework for electronic components. It mainly consists of the following two parts: Core Material: Typically a copper-clad laminate, made by impregnating a reinforcing material with resin, … Read more

Technical Article: Thermal Stress of PCB Substrates

by
Technical Article: Thermal Stress of PCB Substrates

Thermal stress is a type of mechanical stress generally caused by temperature changes that prevent an object from expanding or contracting freely, resulting in internal stress within the object. When an object is subjected to external constraints or internal parts are mutually restrained, factors such as temperature gradients, restricted thermal expansion and contraction of materials, … Read more

What Parameters Are There for Circuit Boards?

by
What Parameters Are There for Circuit Boards?

PCB Circuit Board Parameters 1. Dielectric Constant (DK Value): This usually indicates the ability of a material to store electrical energy. The smaller the ∑ value, the lower the energy storage capacity, and the faster the transmission speed. 2. Glass Transition Temperature (TG): When the temperature rises to a certain range, the substrate transitions from … Read more

What Parameters Are There for Circuit Boards?

by
What Parameters Are There for Circuit Boards?

PCB Circuit Board Parameters 1. Dielectric Constant (DK Value): This typically indicates the ability of a material to store electrical energy. The smaller the DK value, the less energy it can store, and the faster the transmission speed. 2. Glass Transition Temperature (TG): When the temperature rises to a certain range, the substrate transitions from … Read more

Experimental Research on Chip Embedded Manifold Microchannel Heat Sink (Series Work Review)

by
Experimental Research on Chip Embedded Manifold Microchannel Heat Sink (Series Work Review)

01 Research Background The integration and computational speed of chips are rapidly increasing, leading to a sharp rise in energy consumption and heat generation density. Efficient heat dissipation technology has become a critical technological bottleneck restricting the development of high-performance chips. Microchannel heat sinks, with their high integration and heat dissipation density, have emerged as … Read more

How to Design PCB Chip Heat Sink Pads?

by
How to Design PCB Chip Heat Sink Pads?

In working circuit boards, there are many components that generate significant heat, such as MOSFETs, LEDs, and transistors, especially under full load conditions. Heat dissipation vias are a well-known method for dissipating heat through surface-mounted components on circuit boards. Structurally, a via is drilled into the board, and if the board is a single-layer or … Read more

PCB-Level Thermal Design (Part 2)

by
PCB-Level Thermal Design (Part 2)

PCB-Level Thermal Design (Part 2) Recently, I have been busy with work and haven’t updated for a long time. Let’s continue with the design concepts of PCB thermal design. This issue mainly focuses on transient thermal resistance, which is an easily overlooked parameter. When estimating the junction temperature of power devices, thermal resistance is used, … Read more