thermal stress

Breaking Through the Bottleneck of 3D Printing! Chinese Scientists Develop Niobium Alloy Resistant to 1600°C High Temperatures, Performance Enhanced Sevenfold

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Breaking Through the Bottleneck of 3D Printing! Chinese Scientists Develop Niobium Alloy Resistant to 1600°C High Temperatures, Performance Enhanced Sevenfold

In fields such as aerospace and energy, the demand for metal materials that can withstand extreme high temperatures is increasingly urgent. However, traditional manufacturing techniques struggle to process complex structures of high-temperature components, while 3D printing technology has faced challenges in applying to thermally sensitive metals due to high thermal stress issues.Recently, Chinese scientists have … Read more

Technical Article: Thermal Stress of PCB Substrates

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Technical Article: Thermal Stress of PCB Substrates

Thermal stress is a type of mechanical stress generally caused by temperature changes that prevent an object from expanding or contracting freely, resulting in internal stress within the object. When an object is subjected to external constraints or internal parts are mutually restrained, factors such as temperature gradients, restricted thermal expansion and contraction of materials, … Read more

PCB Warpage Control Solutions (Supplement)

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PCB Warpage Control Solutions (Supplement)

PCB warpage is very common during the production and processing of PCBs. Once it occurs, it can seriously affect the performance and reliability of the product, such as poor soldering and component damage. How can we effectively control PCB warpage? First, we need to understand 1. Standards for PCB Warpage According to IPC standards, the … Read more

Analysis and Improvement Discussion on Through-Hole ICD Issues in PCB Manufacturing

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Analysis and Improvement Discussion on Through-Hole ICD Issues in PCB Manufacturing

Failure of PCB Through-Hole ICD: Analysis and Prevention of Inner Layer Interconnection Defects As electronic products evolve towards higher density and reliability, ICD issues have increasingly become a key factor affecting PCB quality. The risk of ICD failure significantly increases, especially in high-frequency, high-speed materials, thick boards, and HDI boards. Understanding the mechanisms of ICD … Read more

Causes of PCB Deformation and Improvement Measures

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Causes of PCB Deformation and Improvement Measures

During the reflow soldering process, circuit boards are often prone to warping and bending. In severe cases, this can lead to issues such as cold solder joints and component misalignment. How can we overcome these challenges? 1. The Dangers of PCB Deformation In automated surface mount lines, if the circuit board is not flat, it … Read more