Today, let’s talk about chip design. The production of chips involves three core steps: design, manufacturing, and packaging/testing.In simple terms, chip design is about drawing circuit diagrams on silicon wafers, but it is not done directly on the wafers. The software used for this is EDA (Electronic Design Automation) software, which is mainly monopolized by … Read more
In the field of semiconductor chip manufacturing, MPW (Multi-Project Wafer), or Multi-Project Wafer, is a collaborative model that combines multiple different design projects onto the same wafer for manufacturing. This model is particularly suitable for companies, universities, and research institutions with limited R&D budgets, significantly lowering the economic threshold for single wafer runs through a … Read more
On June 2, according to data from Siemens Electronic Design Automation (EDA) tools, the success rate of first tape-out for chip designs has dropped to a historic low of 14%, a significant decrease from 24% two years ago. This means that eight out of ten chip design companies will encounter failure during their first tape-out. … Read more
Hello everyone, I am Chip Language. Today, let’s dive into the world of chip cultivation—from design to mass production, chips must go through numerous challenges: Tape-Out is the foundation, packaging testing is the tribulation, and yield is the ascension KPI… The fate of engineers is to protect the chips while sacrificing their hair for merit. … Read more
Process Node Process Type Technical Features 2nm Logic, Nanosheet (0.75V, shrink) Utilizes nanosheet technology with a 0.75V operating voltage and shrink characteristics, which helps improve chip integration and performance. 3nm Logic, Fin FET (0.75/1.2V, shrink)Logic, Fin FET (0.75/1.2V, Non-shrink) Based on Fin Field Effect Transistor technology, it offers different voltage combinations (0.75/1.2V) with both shrink … Read more