TSMC Process Nodes for 2025
Process Node Process Type Technical Features 2nm Logic, Nanosheet (0.75V, shrink) Utilizes nanosheet technology with a 0.75V operating voltage and shrink characteristics, which helps improve chip integration and performance. 3nm Logic, Fin FET (0.75/1.2V, shrink)Logic, Fin FET (0.75/1.2V, Non-shrink) Based on Fin Field Effect Transistor technology, it offers different voltage combinations (0.75/1.2V) with both shrink … Read more