On June 2, according to data from Siemens Electronic Design Automation (EDA) tools, the success rate of first tape-out for chip designs has dropped to a historic low of 14%, a significant decrease from 24% two years ago. This means that eight out of ten chip design companies will encounter failure during their first tape-out. … Read more
Hello everyone, I am Chip Language. Today, let’s dive into the world of chip cultivation—from design to mass production, chips must go through numerous challenges: Tape-Out is the foundation, packaging testing is the tribulation, and yield is the ascension KPI… The fate of engineers is to protect the chips while sacrificing their hair for merit. … Read more
Process Node Process Type Technical Features 2nm Logic, Nanosheet (0.75V, shrink) Utilizes nanosheet technology with a 0.75V operating voltage and shrink characteristics, which helps improve chip integration and performance. 3nm Logic, Fin FET (0.75/1.2V, shrink)Logic, Fin FET (0.75/1.2V, Non-shrink) Based on Fin Field Effect Transistor technology, it offers different voltage combinations (0.75/1.2V) with both shrink … Read more