Ceramic sensors have very strict requirements for dimensional accuracy, which is mainly reflected in two aspects. On one hand, the dimensional accuracy of the sensor directly affects its fit during the assembly process and its reliability during use. If there are significant deviations in the sensor’s dimensions, it may lead to difficulties during assembly or … Read more
Guide to Learning Circuit Board Technology Overview This learning guide aims to help you review and consolidate your understanding of the circuit board technologies introduced in the source material. The source material discusses various types of Printed Circuit Boards (PCBs), their applications, key steps in the manufacturing process, and connection methods. It also covers different … Read more
Guide to the Structure and Manufacturing Methods of Flexible Circuit Boards Abstract This guide aims to help you review and consolidate your understanding of Flexible Printed Circuit Boards (FPCB), Chip on Film (COF) modules, and their manufacturing methods. The main content covers the components of flexible circuit boards, the characteristics of bent and non-bent areas, … Read more
1. Abstract The drilling process is one of the most important components of the entire printed circuit board (PCB). Parameters such as hole position accuracy, hole diameter tolerance, and hole wall roughness directly affect the quality of the PCB and the reliability of product performance. Therefore, strict control of relevant quality items is required during … Read more
Guide to Multilayer Circuit Board Manufacturing Technology Learning Objectives This guide aims to help you review and understand the methods of multilayer circuit board manufacturing and the resulting circuit boards. It focuses on the following aspects: Core Technology: Understand the core innovations of this patent, which is a method that simplifies the multilayer circuit board … Read more
2. Technical Field The invention relates to a method for manufacturing multilayer circuit boards and the multilayer circuit boards obtained by this method. In particular, as consumer electronic products increasingly develop towards being thinner, smaller, and smarter, the requirements for circuit boards (FPC) as important components are becoming higher. In existing technologies, the manufacturing of … Read more
The design of BGA (Ball Grid Array) on PCB boards is very common in the industry, and the issue of irregular BGA sizes can severely affect the soldering quality and electrical performance of PCBs. To effectively improve this issue, it is necessary to address it from the aspects of design and manufacturing processes.1. Package Design1. … Read more
These days, smartphone manufacturers are fiercely competing, and behind the scenes, chip giants are battling it out. Qualcomm’s Snapdragon is making waves, and MediaTek is not idle either; recently, news about the Dimensity 9500 has surfaced. Regarding the manufacturing process, the Dimensity 9500 utilizes TSMC’s N3P process. This is a more advanced production line, allowing … Read more
The design of PCBs is closely related to the production and subsequent use of PCBs and PCBA. This article introduces the relationship between PCB molding, panel separation, and PCB design.01 Introduction to Molding and Panel Separation MethodsThe working panel is molded into a shipping panel, which is generally done using a board retrieval machine; the … Read more
PCB edge plating is a process that involves coating or plating conductive materials (usually copper) on the sides of the PCB along its height. Typically, ENIG surface treatment is used for plating at Jiepei. The purpose of edge plating is twofold. First, it provides reliable electrical connections. When the edge of the PCB needs to … Read more