Prices have surged over 50%, with a dramatic increase in HBM demand, presenting a new wave of development opportunities for domestic storage chip companies. The global storage chip market is experiencing a strong uptrend. According to the latest data, storage chip prices have increased by as much as 50%, with Micron Technology reporting a 46% … Read more
Storage, as a core branch of the semiconductor industry, serves as the “data granary” for electronic devices. However, training AI large models requires processing billions of images and trillions of data points, leading to a dual bottleneck of “insufficient capacity and lagging speed” in traditional storage. In this context, High Bandwidth Memory (HBM) has become … Read more
Huawei announced its development roadmap for Ascend chips over the next three years, with the 950, 960, and 970 series set to launch, and for the first time, it disclosed its self-developed high-performance HBM memory technology, accelerating the process of AI computing power independence in China. “Huawei’s accumulation in connectivity technology, continuous investment to achieve … Read more
EETOP focuses on chips and microelectronics, click on the blue text above to follow us. EETOP EETOP Chuangxin Network (Yite Chuangxin): A well-known domestic veteran electronic engineer community and semiconductor industry portal website (1.5 million members) www.eetop.cn bbs.eetop.cn blog.eetop.cn edu.eetop.cn EETOP compiled from allaboutcircuits.In the past month, the FPGA market has been thriving. In this … Read more
👆If you would like to meet regularly, feel free to star 🌟 and bookmark it~ In the rapidly growing artificial intelligence market over the past few years, besides NVIDIA, another chip winner has emerged: SK Hynix. According to financial data, SK Hynix achieved revenue of $16.23 billion in the second quarter of 2025, with profits … Read more
Huawei’s New Technology According to the Science and Technology Innovation Board Daily, Huawei will release an AI SSD on August 12, which reduces the reliance of AI inference on HBM technology. The core principle is to efficiently utilize multi-level KV-Cache cache data that occupies HBM/DRAM, as well as persistently store long sequence text (to SSD), … Read more
Today’s Highlights Declining utilization rate, Samsung reduces HBM3E production Samsung Electronics may face significant losses in Q2 HBM and NAND shipments exceed expectations SK Hynix launches its first PCIe 5.0 SSD SK Hynix supplies HBM to two major giants HBM dedicated equipment TC Bonder 4 unveiled 01 Declining Utilization Rate, Samsung Reduces HBM3E Production Samsung … Read more
Today’s Highlights 1. Three Major Manufacturers Compete for the HBM Market2. Phison Releases Enterprise SSD Controller3. LG Launches HBM Bonding Equipment4. Taiwan Semiconductor Manufacturing Company Revenue to Exceed 100 Billion5. Wafer-Level Packaging Doubles Computing Power 01 Three Major Manufacturers Compete for the HBM Market Samsung Electronics, SK Hynix, and Micron are expanding their supply of … Read more
With the increasing performance demands of chips driven by technologies such as AI, 5G, and autonomous driving, traditional packaging methods are gradually losing their advantages. An emerging technology—Hybrid Bonding—is becoming a key breakthrough in advanced packaging. It is reshaping the way chips connect, becoming the core process for high-performance computing, high-bandwidth memory (HBM), and ultra-high-layer … Read more
With the rapid growth of the Application-Specific Integrated Circuit (ASIC) market focused on specific AI service performance, companies like Amazon, Google, and Meta are becoming the “giants” in the HBM market. Previously, HBM supply was mainly concentrated among AI semiconductor companies like NVIDIA and AMD. As supply sources diversify, competition among memory semiconductor manufacturers producing … Read more