Thermal Management

The Surge in Cooling Demand Driven by AI Fuels Metal 3D Printing: Alloy’s Stacked Forging 3D Printed Liquid Cooling Plates Revolutionize Data Center GPU Server Cooling

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The Surge in Cooling Demand Driven by AI Fuels Metal 3D Printing: Alloy's Stacked Forging 3D Printed Liquid Cooling Plates Revolutionize Data Center GPU Server Cooling

Antarctic Bear Guide: Many may not yet realize that the global surge in AI computing power could significantly drive the large-scale development of the metal 3D printing industry, particularly in the field of green laser or red laser 3D printed copper alloys. △Copper DLC cooling plates from Alloy Enterprises In August 2025, Antarctic Bear learned … Read more

Immersion Liquid Cooling Technology Supports AI Robot Heat Dissipation

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Immersion Liquid Cooling Technology Supports AI Robot Heat Dissipation

Currently, AI robots are experiencing explosive growth, and their continuous evolution relies on a powerful “cooling heart.” With the practical application of large models like NVIDIA’s GB200, which have hundreds of billions of parameters, traditional air cooling technology can no longer meet the demands and has reached its physical limits. At this time, immersion liquid … Read more

Huawei’s Exclusive Supplier for Liquid Cooling! NVIDIA + Robotics + Military + Chips – Greater Potential than NewEase

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Huawei's Exclusive Supplier for Liquid Cooling! NVIDIA + Robotics + Military + Chips - Greater Potential than NewEase

The super potential stocks in the technology sector have emerged in August! Not only does it have deep collaborations with domestic and international giants such as NVIDIA, Tesla, and Xiaomi, but it is also recognized as the exclusive supplier of Huawei’s liquid cooling pumps. More critically, this company applies motors, controllers, and liquid cooling technology … Read more

Samsung Aims to Turn the Tide with the World’s First 2nm SoC: Exynos 2600

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Samsung Aims to Turn the Tide with the World's First 2nm SoC: Exynos 2600

As is well known, the development of Samsung’s self-developed Exynos chips has been fraught with challenges. Clearly, at this critical technological node of 2nm, Samsung is fully betting on the flagship SoC, Exynos 2600. This is not just a new generation mobile chip; it represents a comprehensive upgrade in Samsung’s 2nm GAA process, packaging technology, … Read more

PCB Selection Guide: A Technical Manual Essential for Engineers

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PCB Selection Guide: A Technical Manual Essential for Engineers

In the field of electronic design, the PCB selection guide is a core tool for engineers to avoid design risks and optimize product costs. A suitable circuit board, like a solid foundation, directly determines the performance, reliability, and market competitiveness of the final product. This guide aims to provide a systematic PCB selection framework to … Read more

Aismalibar: High-End Thermal Management Solutions for the PCB Industry

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Aismalibar: High-End Thermal Management Solutions for the PCB Industry

Aismalibar has over 60 years of experience in manufacturing high-end copper foil and metal clad laminates for the printed circuit board industry. 1934 – Walter L. Ankli foundedAismalibar. 1958 – We began producing copper-clad laminates for printed circuit boards. 1965 – We established a copper laminate factory to produceXPC,FR2 andFR4. 1995 – Development of CEM-3 … Read more

Southeast University | Interleaved Leaf Vein Shaped Embedded Microchannel Heat Exchanger

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Southeast University | Interleaved Leaf Vein Shaped Embedded Microchannel Heat Exchanger

Interleaved Leaf Vein Shaped Embedded Microchannel Heat Exchanger Authors Xu Liu, Zhiyuan Yu, Sichang Qian, Zhuo Zhang, Jiangfeng Yao Abstract This invention discloses an interleaved leaf vein shaped embedded microchannel heat exchanger, belonging to the field of heat exchangers. The heat exchanger has N inflow branches and N+1 outflow branches etched on the substrate, where … Read more

High In-Plane Thermal Conductivity and Excellent Photo-Thermal Performance of Polydimethylsiloxane Composites

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High In-Plane Thermal Conductivity and Excellent Photo-Thermal Performance of Polydimethylsiloxane Composites

Background Introduction With the development of high power and miniaturization of flexible electronic devices, their power density has increased dramatically, leading to severe heat accumulation issues. There is an urgent need for flexible high thermal conductivity materials to dissipate heat quickly and efficiently, ensuring the operational stability of electronic devices. Polydimethylsiloxane (PDMS) is widely used … Read more

Renesas Electronics Launches High-Density Power Conversion 650V GaN FETs

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Renesas Electronics Launches High-Density Power Conversion 650V GaN FETs

As a leading supplier of advanced semiconductor solutions, Renesas Electronics has launched three new high-voltage 650V GaN FETs for AI data centers and server power systems, including a new 800V HVDC architecture, electric vehicle charging, UPS battery backup equipment, battery storage, and solar inverters. These fourth-generation Plus (Gen IV Plus) devices are designed for multi-kilowatt … Read more

The Surge in GPU Power Consumption: How Two-Phase Liquid Cooling Technology Drives a Revolution in Chip Thermal Management

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The Surge in GPU Power Consumption: How Two-Phase Liquid Cooling Technology Drives a Revolution in Chip Thermal Management

With the rapid development of AI and big data applications, the demand for computing power in data centers is gradually increasing, especially the power consumption (TDP) of high-performance computing devices such as GPUs is rising at an astonishing rate. Traditional air cooling systems are increasingly unable to meet this demand, leading to the emergence of … Read more