High In-Plane Thermal Conductivity and Excellent Photo-Thermal Performance of Polydimethylsiloxane Composites
Background Introduction With the development of high power and miniaturization of flexible electronic devices, their power density has increased dramatically, leading to severe heat accumulation issues. There is an urgent need for flexible high thermal conductivity materials to dissipate heat quickly and efficiently, ensuring the operational stability of electronic devices. Polydimethylsiloxane (PDMS) is widely used … Read more