With the continuous improvement of integrated circuit manufacturing technology and process levels, CPUs are increasingly developing towards high integration, miniaturization, and multifunctionality, leading to a sharp increase in CPU heat. In high-temperature environments, the aging rate, loss rate, and failure rate of chips increase exponentially, affecting the normal operation of CPUs and related devices. Left: … Read more
The super potential stocks in the technology sector have emerged in August! Not only does it have deep collaborations with domestic and international giants such as NVIDIA, Tesla, and Xiaomi, but it is also recognized as the exclusive supplier of Huawei’s liquid cooling pumps. More critically, this company applies motors, controllers, and liquid cooling technology … Read more
Driven by the dual forces of explosive computing power demand and the construction of green data centers, liquid cooling technology has become the core path to breaking through computing power bottlenecks and is now the focus of collaborative innovation in the global computing industry. Recently, the “GCC Lounge” series of interviews “CXO Path” invited Mr. … Read more
This summary is sourced from the internet. If the organization believes it is inappropriate to disseminate, please leave a message in the background of the 【Wenbagu Research Summary】 public account to delete the summary! We apologize for any inconvenience caused! The GPU+ASIC liquid cooling market is experiencing a comprehensive explosion, emphasizing the importance of a … Read more
On July 15, 2025, the Asia Data Center Summit and Exhibition (Data Center Asia) kicked off in Hong Kong, China. The Global Computing Alliance (GCC) was invited to attend, and Mr. Miao Fuyou, CTO of the secretariat, delivered a keynote speech titled “Dual-Zero Initiative: Mission on Material Compatibility to Accelerate Liquid-Cooling Deployment”, focusing deeply on … Read more
With the rapid development of AI and big data applications, the demand for computing power in data centers is gradually increasing, especially the power consumption (TDP) of high-performance computing devices such as GPUs is rising at an astonishing rate. Traditional air cooling systems are increasingly unable to meet this demand, leading to the emergence of … Read more
01 Overview of Chip Cooling ▌Origin of Chip Cooling: The essence of electronic device heating is the conversion of work energy into thermal energy The fundamental reason for the heating of electronic devices is the process of converting work energy into thermal energy. As the core component of electronic devices, the basic working principle of … Read more
As semiconductor devices increasingly require more compact and efficient characteristics, this leads to an increase in heat generation, necessitating more effective cooling solutions. Conventional cooling methods such as jet impingement and spray cooling have complex operational issues, while microchannel heat exchangers effectively increase the heat transfer surface area but resulted in higher pressure losses and … Read more
In the rapidly developing field of liquid cooling technology, the “cold plate” is no longer the only solution. When faced with AI chips and power modules that can generate hundreds of watts, or even kilowatts of heat density, traditional cooling solutions are becoming inadequate. The challenge of how to “precisely extract” heat from the core … Read more
Source | OCP Official Website [Insights on Thermal Management] Recently, the OCP official website released a white paper titled “30℃ Coolant– A Durable Roadmap for The Future” authored by a team from META, Vertiv, Samsung, AMD, Intel, and Nvidia, leading participants in the global data center industry. The article focuses on the temperature standards for … Read more