In the vast and wondrous world of the periodic table, the argon atom stands out as a paragon of noble tranquility. This unreactive and inert gas, represented by the chemical symbol Ar and atomic number 18, is more than just a chemical element; it is a testament to the beauty and order inherent in the … Read more
Metal core multilayer printed circuit boards, as the name suggests, are multilayer boards with an embedded0.1mm~1.5mm thick metal core (such as Cu,Al,Cu-Invar-Cu etc.), widely used inLED lighting, high-performance computing, automotive electronics, and other fields. Metal core multilayer boards have the following specific functions: l High Power Heat Dissipation The core components of ordinary printed circuit … Read more
The previous issue mainly introduced the eutectic adhesive method. This article discusses the solder paste method in chip mounting, exploring the technology that utilizes alloy reactions to achieve chip adhesion. The solder paste method, with its excellent thermal conductivity, has become a commonly used mounting method for high-power components. If you want to stay updated, … Read more
What? Are there environmentally friendly circuit boards? What exactly is halogen-free PCB, which is widely used abroad? How does halogen-free board differ from the regular boards we usually make? Today, I will help you solve these questions! Halogen-free PCB from Lieban has attracted the attention of some users, especially environmentally friendly technology companies, which have … Read more
Background Introduction With the development of high power and miniaturization of flexible electronic devices, their power density has increased dramatically, leading to severe heat accumulation issues. There is an urgent need for flexible high thermal conductivity materials to dissipate heat quickly and efficiently, ensuring the operational stability of electronic devices. Polydimethylsiloxane (PDMS) is widely used … Read more
Traditional thermal sink materials (such as W/Cu, Mo/Cu, and SiC/Al) generally have thermal conductivities below 200 W/(m·K), making it difficult to meet the heat dissipation requirements of high-power devices (such as GaN and SiC). Carbon materials represented by diamond and graphene, with their ultra-high thermal conductivity (diamond reaches 2200 W/(m·K)) and low thermal expansion coefficient … Read more
First Author: Solveig S. Aamlid, University of British Columbia, Stewart Blusson Quantum Matter Institute. Corresponding Author: Alannah M. Hallas, from the University of British Columbia, Stewart Blusson Quantum Matter Institute, Department of Physics and Astronomy, University of British Columbia 1. Definition and Characteristics of High-Entropy Materials The definition of high-entropy materials is not yet unified, … Read more
1. Technology and Applications of 3D Printed Molds3D printed molds, such as injection molds, have always been regarded as a promising application direction for metal 3D printing in the industry. There are three main reasons:(1) Complex cooling channels can almost only be achieved through 3D printing;(2) It must be combined with simulation, which is quite … Read more
In natural convection heat dissipation products, the size of vias on the PCB has a significant impact on heat dissipation. However, the exact extent of this impact is still unknown. We will start with a simple product analysis, focusing on the via parameters of a single chip, to study how changes in via parameters affect … Read more
In the manufacturing of modern electronic devices, printed circuit boards (PCBs) are crucial components. The design of PCBs involves many factors, among which the characteristics of PCB materials are one of the key factors determining the performance and reliability of the circuit board. Different PCB materials exhibit different behaviors in thermal, mechanical, and electrical aspects, … Read more