Blind and Buried Via Plating Technology: Decoding the Precision Process of High-Density Interconnect PCB Manufacturing
How does traditional plating address the “dog bone effect” and void defects when the aspect ratio of the interlayer vias exceeds 10:1? Technical Principles and Process Challenges Structural Characteristics of Blind and Buried Vias Definition Differences Blind Via: Connects outer layers to inner layers, typically 50-200μm deep Buried Via: Completely embedded within inner layers, aspect … Read more
