The previous issue mainly introduced the eutectic adhesive method. This article discusses the solder paste method in chip mounting, exploring the technology that utilizes alloy reactions to achieve chip adhesion. The solder paste method, with its excellent thermal conductivity, has become a commonly used mounting method for high-power components. If you want to stay updated, … Read more
Click on the title below “Yingchuangli” to quickly follow Air bubbles generated during PCBA soldering, commonly referred to as voids, typically occur during the reflow soldering and wave soldering processes in PCBA manufacturing. So, how can we prevent air bubbles during PCBA soldering? 1. Baking Bake PCBs and components that have been exposed to air … Read more
Introduction: A Manufacturing Revolution from “Millimeter” to “Micrometer” Scale As Moore’s Law approaches its physical limits, the main battleground for increasing chip integration has shifted from wafer processing to advanced packaging. The rise of System-in-Package (SiP), 3D stacking, and heterogeneous integration technologies presents unprecedented challenges for micrometer-level interconnection processes. Traditional stencil printing is limited by … Read more