Thermal Sink Materials for Semiconductor Lasers
Traditional thermal sink materials (such as W/Cu, Mo/Cu, and SiC/Al) generally have thermal conductivities below 200 W/(m·K), making it difficult to meet the heat dissipation requirements of high-power devices (such as GaN and SiC). Carbon materials represented by diamond and graphene, with their ultra-high thermal conductivity (diamond reaches 2200 W/(m·K)) and low thermal expansion coefficient … Read more
