voids

Analysis and Optimization of Copper Plating Voids in Small Diameter PCB Through-Holes

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Analysis and Optimization of Copper Plating Voids in Small Diameter PCB Through-Holes

In PCB manufacturing, the occurrence of voids in small diameter through-hole copper plating is indeed a troublesome issue, as it directly affects the reliability of the circuit and the yield of the product. This is often the result of multiple factors working together. The table below summarizes the common causes of copper plating voids and … Read more

Unit 3: Voids in Coating Layers Inside PCB Holes

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Unit 3: Voids in Coating Layers Inside PCB Holes

During visual inspection (non-sectioning), voids in the copper layer and coating layer of the hole (void) are common defects. Voids identified during visual inspection refer to areas exposing the substrate material, while voids identified through section analysis refer to areas below the minimum thickness specification, indicating a fundamental difference between the two. Different grades of … Read more