2023 Annual Review Time flies, and the end of the year is upon us. In 2023, Arm Technology Academy published over 400 technical articles covering various technology fields. We appreciate everyone’s support along the way. To facilitate everyone’s learning and growth, we have compiled the 20 most popular articles of the year based on backend … Read more
SoC and Chiplet Integration1. Introduction SoC integrates ICs with different functions into a single chip for a system or subsystem. The figure shows the evolution of Apple’s application processors (AP) from A10 to A14, illustrating the relationship between the number of transistors in chips of different feature sizes and the years. It is evident that … Read more
As reported by Nextplatform, the x86 architecture took 15 years to gain a significant share in data center computing, while the Arm architecture took about 10 years to establish a measurable foothold. Perhaps the RISC-V architecture could achieve the same in just five years, as hyperscale companies and cloud builders are tired of not having … Read more
Author: Wenjing Zhan ShiIoT Think Tank, Organized and Published “The semiconductor market is beginning to recover.” This is the view expressed by many research institutions and industry experts recently, marking the first growth since 2021. For IoT chip players, this is certainly a ray of hope. Moreover, the number of IoT connections continues to grow, … Read more
On July 31, according to Reuters, semiconductor IP giant Arm announced its second-quarter financial forecast, which fell short of market expectations. This disappointment was partly due to Arm’s plan to invest some profits into manufacturing its own chips and other components, leading to an 8.65% drop in Arm’s stock price in after-hours trading. Arm’s CEO, … Read more
From 2000 to 2010, the Chinese semiconductor industry sat on the sidelines for a decade. Before 2014, the golden age of the internet was a winter for semiconductors.A decade is a cycle, and the financing of China’s semiconductor industry has reached a trillion yuan level, with visible bubbles behind the prosperity.Moreover, the international situation is … Read more
On June 5, semiconductor IP company Alphawave Semi announced that its UCIe IP subsystem has successfully taped out, utilizing TSMC’s 2nm (N2) process, supporting a 36G Die-to-Die data rate. This IP is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on … Read more
On April 22, the front page of the Shaoxing Daily reported: “Qili Semiconductor’s Advanced Packaging Technology Leads in China: Building Chips Like LEGO”. The full text is as follows ↓↓↓ Like stacking LEGO blocks, different specifications and characteristics of small chips are stacked together and packaged to form a complete chip, achieving characteristics such as … Read more
April 29, 2025, Shanghai, China – VeriSilicon Holdings Co., Ltd. (VeriSilicon, stock code: 688521.SH) recently announced that itsautomotive-grade high-performance smart driving system-on-chip (SoC) design platform has completed verification and has been successfully implemented in customer projects. Based on VeriSilicon’s Silicon Platform as a Service (SiPaaS) business model, this platform provides robust technical support for high-performance … Read more
Intel unveiled its next-generation SoC at the Shanghai Auto Show. On April 23, Intel participated in the Shanghai Auto Show for the first time, launching the second-generation AI-enhanced Software Defined Vehicle System-on-Chip (SDV SoC). The chip is designed based on a Chiplet architecture, focusing on smart cockpit and autonomous driving scenarios. It supports generative AI … Read more