April 29, 2025, Shanghai, China – VeriSilicon Holdings Co., Ltd. (VeriSilicon, stock code: 688521.SH) recently announced that itsautomotive-grade high-performance smart driving system-on-chip (SoC) design platform has completed verification and has been successfully implemented in customer projects. Based on VeriSilicon’s Silicon Platform as a Service (SiPaaS) business model, this platform provides robust technical support for high-performance computing needs such as autonomous driving and advanced driver-assistance systems (ADAS).
VeriSilicon’s chip design process has obtained ISO 26262 automotive functional safety management system certification, providing one-stop customized services for automotive chips that meet functional safety requirements for global customers, covering aspects such as chip and IP design implementation and software development. Combined with the company’s rich portfolio of automotive-grade IP and a complete smart driving software platform framework, VeriSilicon can offer full-process support for customers from chip design and verification to automotive certification, including safety requirement analysis, architecture design, and certification support.
The newly launched automotive-grade high-performance smart driving SoC design platform features a flexible and configurable architecture, supporting efficient collaboration among multiple co-processors such as high-performance multi-core central processing units (CPUs), image signal processors, video codecs, and neural network processors. It optionally includes VeriSilicon’s self-developed ASIL D level functional safety island and supports high-speed, high-bandwidth storage subsystems, boasting excellent data throughput and real-time processing capabilities. The platform is also optimized for advanced automotive process technologies, including 5nm and 7nm, offering outstanding power, performance, and area (PPA) characteristics.
“The smart automotive industry is rapidly developing, and VeriSilicon’s automotive-grade SoC design platform balances performance, safety, and design flexibility, helping automotive companies quickly respond to market demands,” said Wang Zhiwei, Executive Vice President and General Manager of the Custom Chip Platform Division at VeriSilicon. “VeriSilicon has been deeply involved in the automotive field for over a decade, with layouts from microcontroller units (MCUs) to cockpit and smart driving technologies. Based on our automotive-certified chip design process, automotive-grade IP, and complete software services, VeriSilicon has successfully provided customers with customized smart driving chips based on advanced automotive process technologies and is advancing the development of Chiplet solution platforms in the smart mobility field. In the future, VeriSilicon will continue to deepen technological innovation in the automotive field, contributing to higher levels of safety and intelligence in the smart automotive industry.”
About VeriSilicon
VeriSilicon Microelectronics (Shanghai) Co., Ltd. (VeriSilicon, 688521.SH) is a company that provides platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing services based on proprietary semiconductor IP.
The company has self-controlled graphics processor IP (GPU IP), neural network processor IP (NPU IP), video processor IP (VPU IP), digital signal processor IP (DSP IP), image signal processor IP (ISP IP), and display processor IP (Display Processing IP), as well as over 1,600 mixed-signal IPs and RF IPs.
Based on its proprietary IP, the company has developed a rich portfolio of hardware and software chip customization platform solutions for artificial intelligence (AI) applications, covering lightweight spatial computing devices such as smartwatches and AR/VR glasses that are always-on, high-efficiency edge computing devices such as AI PCs, AI smartphones, smart cars, and robots, as well as high-performance cloud-side computing devices such as data centers/servers.
In response to the trend of SoC (system-on-chip) development towards SiP (system-in-package) driven by the demand for high computing power, VeriSilicon is guided by the principles of “IP as a Chiplet,” “Chiplet as a Platform,” and “Platform as an Ecosystem,” continuously advancing the company’s Chiplet technology, project research and development, and industrialization from aspects such as interface IP, Chiplet chip architecture, advanced packaging technology, and solutions for AIGC and smart mobility.
Based on the company’s unique Silicon Platform as a Service (SiPaaS) business model, the company’s main business applications cover a wide range of fields including consumer electronics, automotive electronics, computers and peripherals, industrial, data processing, and the Internet of Things, with major customers including chip design companies, IDMs, system manufacturers, large internet companies, and cloud service providers.
VeriSilicon was founded in 2001, headquartered in Shanghai, China, with 8 design and R&D centers globally, and 11 sales and customer support offices, currently employing over 2,000 people.
For more information, please visit: www.verisilicon.com
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