Intel Unveils Next-Generation SDV SoC at Shanghai Auto Show

Intel unveiled its next-generation SoC at the Shanghai Auto Show.

On April 23, Intel participated in the Shanghai Auto Show for the first time, launching the second-generation AI-enhanced Software Defined Vehicle System-on-Chip (SDV SoC).

The chip is designed based on a Chiplet architecture, focusing on smart cockpit and autonomous driving scenarios. It supports generative AI and multimodal interaction, with performance improvements of up to 10 times in generative AI and multimodal AI compared to the previous generation, providing computational support for immersive in-car experiences and advanced intelligent driving. Additionally, Intel announced a collaboration with Black Sesame Technologies to develop an integrated cockpit platform and partnered with Wallface Intelligent to research and develop native intelligent cockpit solutions, accelerating the implementation of automotive intelligence technology.

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