Source: Tiger Talks Chips
Original Author: Tiger Talks Chips
This article mainly introduces the differences and connections between wafer, die, and chip.
Wafer — Raw Material and Production Platform
A wafer is the basic material for semiconductor manufacturing, typically made from high-purity silicon (Si) or other semiconductor materials. The wafer is usually a round thin slice, with a thickness ranging from hundreds of micrometers to a few millimeters, and its surface is precisely processed to ensure it is smooth enough and possesses excellent crystal structure, suitable for various electronic device processing.
Analogy: A wafer can be compared to “raw materials” or “paper,” similar to the paper used to produce a book; it is not the final product itself, but it is the foundation for all subsequent processes.
Die — Individual Circuit Unit After Segmentation
On the wafer, a series of semiconductor processes (such as photolithography, doping, etching, etc.) will form numerous integrated circuit structures. Each independent unit within these integrated circuit structures is called a die. A die is obtained by cutting the wafer into multiple small pieces, with each die representing a complete electronic component, usually having full functionality, but at this stage, it has not yet been packaged.
Analogy: A die can be compared to “an individual article on a page of a book.” It is each small part cut from the “entire book,” with each “article” having independent content and functionality, but it is still incomplete, lacking cover, binding, and other steps.
The shape of a die is typically rectangular or square, and the specific requirements for size and shape will vary based on product design, functional requirements, and manufacturing processes. The quality of the die directly affects the quality of the final chip, thus, dies need to undergo strict testing and screening during production (e.g., KGD: Known Good Die, meeting functionality and reliability requirements).
Chip — Finished Product After Packaging
After cutting and testing, the die will be packaged into a complete chip. Packaging not only provides physical protection for the die, preventing damage during use but also connects the chip to external circuits through pins, pads, and other means. The chip is the final product aimed at users and the market; only after packaging does the chip possess actual electrical functionality, allowing it to be part of an integrated circuit (IC) used in various electronic devices.
Analogy: The chip is like a book that has been printed and bound. Each article (die) is integrated into a complete book (chip), complete with a cover and table of contents (packaging), allowing readers (systems) to use the content of this book (chip).
Relationship Between Wafer, Die, and Chip
The wafer is the raw material for production, which after fine processing will form many dies.
A die is an independent unit cut from the wafer, and each die can independently perform specified functions. They typically need to be tested to ensure they are good dies (like KGD dies) and meet electrical performance and reliability requirements.
The chip is the final product obtained by packaging the die, equipped with complete external interfaces, allowing it to connect and work with other electronic devices.
The relationship among these three can be understood through a step-by-step processing sequence: from a large raw material (wafer), to cutting into small units (die), and then to packaging into the final product (chip), with each step being crucial, determining the quality and functionality of the final chip.
END
Reproduced content represents only the author’s views
It does not represent the position of the Institute of Semiconductors, Chinese Academy of Sciences
Editor: One Two
Responsible Editor: Mu Xin
Submission Email: [email protected]
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