Detailed Steps of the Opening Process for Passivation Layer in CMOS Image Sensors
The “opening pad” process for image sensors (especially CMOS image sensors, CIS), officially known as “aluminum pad layer etching” or “passivation layer opening” process, is a critical step in the backend of chip manufacturing. The purpose of this step is to open the insulating layer (passivation layer) on the pads that electrically connect the internal … Read more