Today, let’s talk about Li Awei.
The company covers multiple production stages in the semiconductor industry chain, including silicon single crystal pulling, silicon grinding wafers, silicon polishing wafers, silicon epitaxial wafers, power device chips, and compound semiconductor RF and optoelectronic chips, integrating the entire technology chain from materials to chips.This is the company’s unique advantage in the industry.
The company’s business landscape consists of three core segments: semiconductor silicon wafers, semiconductor power device chips, and compound semiconductor RF chips.
In the field of semiconductor silicon wafers, the company’s heavily doped epitaxial wafers are highly competitive. Since the beginning of 2025, orders for 6-8 inch epitaxial wafer products have been full, with capacity utilization remaining at a high level. More importantly, the shipment volume of 12-inch silicon wafers has seen significant growth, with sales reaching 811,500 pieces in the first half of 2025, a year-on-year increase of 99.14% and a quarter-on-quarter increase of 16.68%.
In the power device chip business, the company fully leverages its integrated supply chain advantages, actively adjusting its product structure, focusing on two major categories: photovoltaic and automotive applications.
Notably, the breakthrough in the RF chip business is worth attention. The company has successfully entered the supply chains of emerging fields such as low Earth orbit satellites, low-altitude economy, robotics, intelligent driving, and optical communication.
The company has made significant breakthroughs in VCSEL chips (Vertical-Cavity Surface-Emitting Lasers). Its subsidiary, Li Aong Dongxin, has developed a two-dimensional addressable VCSEL technology, making it the first and only manufacturer in mainland China to mass-produce two-dimensional addressable laser radar VCSEL chips. This product is used in terminal applications for vehicle intelligent driving blind-spot laser radar, humanoid robots, and sweeping robots, with broad future application scenarios. In the first half of this year, the company sold 1,000 VCSEL chips, a year-on-year increase of 576.19% and a quarter-on-quarter increase of 384.88%.
Additionally, the company’s HBT chips have entered mainstream domestic and international mobile terminal brands, achieving full coverage of core customers and domestic substitution; pHEMT and BiHEMT chips have entered the aerospace, defense market, and low Earth orbit satellite fields; 6-inch silicon carbide-based gallium nitride products have passed customer verification and will be the first to ship in the second half of the year, becoming the first supplier in the country.
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