High-Performance Real-Time Signal Processing Platform Based on Virtex-7 FPGA

Board Overview

TES605 is a high-performance real-time signal processing platform based on the Virtex-7 FPGA. This platform utilizes a TI KeyStone series multi-core DSP TMS320C6678 as the main processing unit and a Xilinx Virtex-7 series FPGA XC7VX690T as the co-processing unit. It features two FMC sub-card interfaces, with various processing nodes interconnected via a high-speed serial bus. The board supports four SFP+ 10G optical fiber interfaces and two RJ45 Gigabit Ethernet ports, making it suitable for high-speed real-time signal processing.

High-Performance Real-Time Signal Processing Platform Based on Virtex-7 FPGAHigh-Performance Real-Time Signal Processing Platform Based on Virtex-7 FPGA

Technical Specifications

1. Supports one multi-core DSP processing node and one Virtex-7 FPGA processing node;

2. Processing Performance:

  • DSP Fixed-point Operations: 40GMAC/Core*8=320GMAC;

  • DSP Floating-point Operations: 20GFLOPs/Core*8=160GFLOPs;

3. Storage Performance:

  • DSP Dynamic Storage: 2GByte DDR3-1333 SDRAM;

  • DSP supports 4GBit Nand Flash, 256MBit BPI Nor Flash;

  • FPGA Dynamic Storage: 2 sets of 2GByte DDR3-1600 SDRAM;

  • FPGA supports one 1Gbit Nor Flash for loading;

4. Interconnection Performance:

  • DSP to FPGA: SRIO x4@5Gbps/lane;

  • FPGA to FMC Interface: 2 channels GTH x4@10Gbps/lane;

  • FPGA provides four SFP+ 10G optical fiber interfaces;

  • DSP provides two RJ45 Gigabit Ethernet interfaces;

5. Physical and Electrical Characteristics

  • Board Size: 200 x 168mm

  • Board Power Supply: 3A max@+12V (±5%)

  • Cooling Method: Metal conduction cooling

6. Environmental Characteristics

  • Operating Temperature: -40°~ +85°C, Storage Temperature: -55°~ +125°C;

  • Operating Humidity: 5%~95%, non-condensing

Software Support

1. Optional integrated board-level software development package (BSP):

  • DSP low-level interface drivers;

  • FPGA low-level interface drivers;

  • Board-level interconnection interface drivers;

  • Low-level drivers for multi-core parallel processing based on SYS/BIOS;

2. Customized algorithms and system integration can be provided based on customer requirements:

Application Areas

1. Software-defined radio;

2. Radar and baseband signal processing;

3. High-speed real-time image processing;

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