The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

The Semiconductor Jargon World: A Guide from Tape-Out to Packaging Testing

Hello everyone, I am Chip Language. Today, let’s dive into the world of chip cultivation—from design to mass production, chips must go through numerous challenges: Tape-Out is the foundation, packaging testing is the tribulation, and yield is the ascension KPI… The fate of engineers is to protect the chips while sacrificing their hair for merit. … Read more

Why Is Your Chip Programming Failing?

Why Is Your Chip Programming Failing?

Many engineers have encountered situations where chip programming works perfectly during the R&D testing phase, but feedback indicates programming failures during mass production. Is this an issue with the chip itself? Or is it a problem with the programmer? Or are there other possibilities? Many engineers face this issue: programming chips works fine during R&D … Read more