Detailed Requirements for High-Speed Signal PCB Routing: eMMC/USB/MIPI/LVDS/RGMII
01 eMMC Signal Impedance and Routing It is recommended to use ground wrapping for CLK and STRB signals, with a ground via every ≤500 mil. During overall layout,eMMC should be placed as close to the SOC as possible to minimize routing length. The reference layer for all eMMC signals must be a complete ground plane … Read more