Understanding Chip Packaging Processes (Traditional Packaging)

Understanding Chip Packaging Processes (Traditional Packaging)

In the previous issue, we introduced some background knowledge about chip packaging:A Beginner’s Guide to Chip PackagingIn this issue, we will focus on the specific process of packaging.As previously mentioned, there are many forms of packaging, including traditional and advanced packaging.Different packaging types have different processes and techniques. After completing the entire write-up, I found … Read more

Four Bonding Methods in Chip Packaging

Four Bonding Methods in Chip Packaging

Chip packaging is a critical step in semiconductor manufacturing, providing physical protection, electrical interconnection, and heat dissipation for chips. Bonding technology is the method of connecting bare chips to external materials. Currently, there are four main bonding technologies: the traditional and reliable Wire Bonding, the high-performance Flip Chip Bonding, the highly automated Tape Automated Bonding … Read more