On August 8, local media ZDNET Korea reported that Tesla is considering a complete supply chain overhaul for its third-generation self-developed AI ASIC chip, Dojo 3, with Samsung Foundry taking on the front-end advanced process manufacturing, while the back-end advanced packaging will be handled by Intel.
It is noted that Tesla’s Dojo 1 chip was entirely manufactured by TSMC, utilizing a 7nm advanced process and InFO-SoW large-area advanced packaging technology, while the second-generation product, Dojo 2, is expected to enter mass production by TSMC within the year.
Elon Musk previously stated plans to unify AI6 with Dojo 3 under a single architecture, meaning instead of developing a standalone Dojo 3, the ASIC Die of AI6 will be reused and scaled up.
Samsung Electronics’ Taylor, Texas, wafer fab will provide 2nm process foundry services for the AI6 chip, and is expected to support Dojo 3 as well; while Intel will be responsible for connecting multiple chip modules using advanced packaging technology based on EMIB.