AI HPC

Morgan Stanley: Free Experience of ‘High Efficiency’ International Investment Bank Research Report ‘T+0 to T+1’

by
Morgan Stanley: Free Experience of 'High Efficiency' International Investment Bank Research Report 'T+0 to T+1'

Free experience of ‘high efficiency’ international investment bank research report ‘T+0 to T+1’‘Original research report’ can be downloaded at the bottom Summary Translation Recently, investors have been highly concerned about the mass production progress of the Trainium 3 substrate (ABF substrate) and are worried about potential delay risks. Through supply chain research, we have outlined … Read more

A Pure C Language Distributed Task Scheduling System 100 Times Lighter than Ray

by
A Pure C Language Distributed Task Scheduling System 100 Times Lighter than Ray

A Pure C Language Distributed Task Scheduling System 100 Times Lighter than Ray Hello everyone, the Laxcus distributed operating system features a distributed task scheduling framework implemented in pure C, named DTT (Distributed Task). Today, I would like to showcase it. First, let’s look at the results (2 machines, zero configuration, done in seconds) Machine … Read more

Novatek Ventures into HPC with DDI Display Driver Chip, N4P Process SoC Tape-out

by

On October 20, 2023, it was reported that Novatek is an integrated circuit (IC) design company based in Taiwan, primarily producing display driver chips (DDI) and digital multimedia SoCs for mobile devices and consumer electronics. According to reports from the Taiwanese media, “Commercial Times,” Novatek completed the first batch of wafer tape-out verification for a … Read more

Qualcomm Snapdragon Summit 2025: Three Chips, One AI Vision

by
Qualcomm Snapdragon Summit 2025: Three Chips, One AI Vision

On September 24, the Qualcomm Snapdragon Summit took place in Hawaii as scheduled. This year, Qualcomm brought not only numerical upgrades on the specification sheet but also a narrative shift. Unlike a decade ago, when the competition was solely about CPU frequency, core count, and GPU performance, Qualcomm has now placed AI at the very … Read more

The New Snapdragon PC Chips Are Here! A True Performance Monster, Qualcomm Teams Up with Google to Create Waves

by
The New Snapdragon PC Chips Are Here! A True Performance Monster, Qualcomm Teams Up with Google to Create Waves

Lei Technology AI Hardware Group | Editor: Sandwich | Supervisor: Luo Chao To be honest, the PC industry has been a bit quiet in recent years, almost like a stagnant pool. Everyone seems to have gotten used to the duet of Intel and AMD, with new product launches resembling toothpaste being squeezed out, calm and … Read more

Understanding the AMD MI300A Chip

by
Understanding the AMD MI300A Chip

The MI300A is AMD’s next-generation data center-level APU (Accelerated Processing Unit) released in 2023, and it is the world’s first HPC chip to seamlessly integrate an x86 CPU and GPU in the same package. It utilizes Chiplet and 3D packaging technology, offering strong general computing and AI acceleration capabilities. Key architectural highlights: Fusion Architecture: Includes … Read more

Bus – HBM2E

by
Bus - HBM2E

I am pleased to provide you with a detailed introduction to the HBM2E bus. HBM2E (High Bandwidth Memory 2E) is a significant milestone in the development of high bandwidth memory technology. To understand HBM2E, it is essential to first grasp its foundation – HBM technology. 1. What is HBM? – Technical Background Traditional GPUs and … Read more

Trends in the Semiconductor Industry and Advanced Packaging Technology Market Analysis

by
Trends in the Semiconductor Industry and Advanced Packaging Technology Market Analysis

1. Overall Industry Recovery Trend The global semiconductor industry is expected to achieve a year-on-year growth of 9.5% in 2024, with total revenue reaching $574 billion. This significant recovery is primarily driven by two core factors: Explosive Demand for High-Performance Computing (HPC): The demand for computing power from data centers and AI training clusters is … Read more

PCB Manufacturers Successfully Surpass AI Challenges! 70% Revenue Growth Expected in 2024, Mid-Year Report Forecasts Another 50% Increase

by
PCB Manufacturers Successfully Surpass AI Challenges! 70% Revenue Growth Expected in 2024, Mid-Year Report Forecasts Another 50% Increase

Reaping the benefits of the AI boom.Author | beyondEditor | Little White Imagine, what is the “nervous system” of your smartphone, computer, or even smart car? It is the printed circuit board (PCB)! This seemingly unremarkable component is the “skeleton” and “blood vessels” of all electronic devices. What is currently the hottest topic in the … Read more

Has RISC-V Really Developed in the AI HPC Market? An Interview with RISC-V International CEO

by
Has RISC-V Really Developed in the AI HPC Market? An Interview with RISC-V International CEO

In April of this year, the consulting firm VDC Research wrote in “Embedded Processor Architectures” that the achievements of RISC-V have expanded beyond embedded computing into storage technology and HPC, demonstrating a trend of broader application for this architecture. This statement was also quoted by Andrea Gallo, CEO of RISC-V International, at this year’s RISC-V … Read more