Breaking the Performance Ceiling of AI Chips! Advanced Packaging Faces 4 Major Challenges, Simulation Technology Becomes the Key to Solutions
As the parameters of AI large models exceed one trillion and the GPU computing race enters the “EFLOPS era,” the enhancement of chip performance can no longer rely solely on process miniaturization—advanced packaging technology is becoming the “second growth curve.” For instance, integrating multiple small chips (Chiplets) like building blocks can enhance performance by three … Read more