Embedded Software & Tools

  • Operating Systems (Linux, RTOS, Android)
  • Firmware Development
  • Embedded Security
  • Development Tools & IDEs
  • AI/ML in Embedded Systems

Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

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Technical Insights from Silicon Carbide Wafer Manufacturers: A Comprehensive Analysis of Hybrid Bonding

Introduction to Senhui: Suzhou Senhui Semiconductor, supported by a strong research and technical team, focuses on providing complete process solutions and wafer services for global compound semiconductor customers. The team members have deep experience in the semiconductor industry, with decades of rich capabilities in photolithography, thin film processes, epitaxy, bonding processes, as well as etching, … Read more

What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

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What is the NRE Stage of MEMS Wafer Fabrication? What is the Relationship Between MPW and NRE?

Source: Chip Learning Original Author: Chip Future The semiconductor wafer fabrication NRE refers to “Non-Recurring Engineering” costs, which are one-time expenses incurred during the chip development process. These costs cover a series of non-recurring work from chip design to the successful first wafer fabrication, including design and R&D expenses, mask production costs, process development and … Read more

Causes of Chip Tape-Out Failures

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Causes of Chip Tape-Out Failures

Recently, while chatting with a prominent figure in the industry, we discussed the topic of chip tape-out failures. I found this to be quite an interesting subject, so I gathered some reasons for chip tape-out failures online and would like to share them here. 1. Incorrect version of the design was used. This issue is … Read more

Optimization Design of Vertical Interconnect Transition Structures for Microwave Circuit Boards

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Optimization Design of Vertical Interconnect Transition Structures for Microwave Circuit Boards

In modern high-frequency microwave circuit design, vertical interconnect transition structures serve as critical paths for signal transmission between different layers of PCBs, and their performance directly affects the overall properties of the system. As communication systems advance into the millimeter-wave frequency band, traditional via structures can no longer meet the integrity requirements for high-frequency signals. … Read more

Dynamic Bending Radius Calculation and Validation of Flexible Printed Circuits

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Dynamic Bending Radius Calculation and Validation of Flexible Printed Circuits

Dynamic Bending Radius Calculation and Validation of Flexible Printed CircuitsIn modern electronic product design, Flexible Printed Circuits (FPC) are widely used in wearable devices, medical electronics, automotive electronics, and aerospace due to their lightweight, foldable, and bendable characteristics. However, during the design of FPCs, dynamic bending is a crucial factor that must be accurately calculated … Read more

Composition, Design, Process, Workflow, and Principles of Component Placement and Routing for PCB Circuit Boards

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Composition, Design, Process, Workflow, and Principles of Component Placement and Routing for PCB Circuit Boards

Let’s learn about the composition, design, process, workflow, and principles of component placement and routing for PCB circuit boards, along with some considerations for the later stages! Composition of PCB Circuit Boards 1. Lines and Planes: The lines serve as the conductive paths between components, and a large copper area is designed separately for grounding … Read more

Top 10 Automotive Grade MCU Chips Preferred by Chinese Engineers

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Top 10 Automotive Grade MCU Chips Preferred by Chinese Engineers

According to authoritative market research institutions, the global MCU market size is expected to reach approximately $17.79 billion in 2020, with shipments exceeding 28 billion units. This year’s MCU market size is projected to reach $18.48 billion, with a compound annual growth rate (CAGR) of 10.1% from 2021 to 2028, growing to $36.16 billion by … Read more

Single-Stage Amplifier Circuit Design Tutorial (Multisim Simulation + Installation Debugging + Formula Summary)

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Single-Stage Amplifier Circuit Design Tutorial (Multisim Simulation + Installation Debugging + Formula Summary)

The amplifier circuit can increase the output power of a signal. It obtains energy from the power supply to control the output signal waveform to be consistent with the input signal but with a larger amplitude. In this sense, the amplifier circuit can also be viewed as a controllable output power source used to achieve … Read more

Proteus Simulation Experiment: Memory (Non-Expanded)

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Proteus Simulation Experiment: Memory (Non-Expanded)

Experiment Objective:1. Understand computer storage systems;2. Use Proteus simulation software to draw equivalent circuit diagrams and verify static random access memory (SRAM) chips;3. 6116 memory chip;4. 74LS245 chip, 74LS373 chip.Basic Principle: This experiment aims to verify the static random access memory chip, so the 6116 is selected as the memory chip. The 74LS373 chip is … Read more

Usage Methods for Multimeters, Megohmmeters, Clamp Meters, and Ground Resistance Meters

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Usage Methods for Multimeters, Megohmmeters, Clamp Meters, and Ground Resistance Meters

1. Usage of Multimeters 1. Understanding Common Symbols on Multimeters Types of electrical measurements and switch positions: ACV (or V) — AC voltage range, typically includes 2.5V, 10V, 50V, 250V, 500V, etc. DCV (or V) — DC voltage range, typically includes 0.5V, 2.5V, 10V, 50V, 250V, 500V, etc. DCmA (or mA) — DC milliamp range, … Read more